Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this re...
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| Format: | Article |
| Language: | English |
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Trans Tech Publications, Switzerland
2012
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| Online Access: | http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/1/AMR_from_kak_ija.pdf |
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eprints |
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ump-52022018-01-15T08:22:23Z http://umpir.ump.edu.my/id/eprint/5202/ Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Azmah Hanim, Mohamad Ariff T Technology (General) TN Mining engineering. Metallurgy In electronic packaging industry, they are now driven technology to green product by replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can fulfill this requirement. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and electroless nickel/ immersion palladium/immersion gold (ENEPIG). Reliability of solder joint is also examined by performing solid state isothermal aging at 125˚C and 150˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time and temperature of solder joints results in an increase of IMC’s thickness and changes their morphologies to become more spherical, dense and with larger grain size. In addition, the results also revealed that the thickness of intermetallics formed is proportional to the aging duration and temperature. Trans Tech Publications, Switzerland 2012 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5202/1/AMR_from_kak_ija.pdf Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Azmah Hanim, Mohamad Ariff (2012) Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish. Advanced Materials Research, 415-417. pp. 1181-1185. ISSN 1022-6680 (print), 1662-8985 (online) http://dx.doi.org/10.4028/www.scientific.net/AMR.415-417.1181 DOI: 10.4028/www.scientific.net/AMR.415-417.1181 |
| repository_type |
Digital Repository |
| institution_category |
Local University |
| institution |
Universiti Malaysia Pahang |
| building |
UMP Institutional Repository |
| collection |
Online Access |
| language |
English |
| topic |
T Technology (General) TN Mining engineering. Metallurgy |
| spellingShingle |
T Technology (General) TN Mining engineering. Metallurgy Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Azmah Hanim, Mohamad Ariff Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| description |
In electronic packaging industry, they are now driven technology to green product by
replacing leaded-solder with lead-free solder in order to fulfill the European Restriction of Hazardous
Substance (RoHS) compliance. Thus, Sn-Ag-Cu lead-free solder family is one of candidates can
fulfill this requirement. This study investigates the interfacial reactions during reflow soldering and
isothermal aging between Sn-3.0Ag-0.5Cu (SAC305) and electroless nickel/ immersion
palladium/immersion gold (ENEPIG). Reliability of solder joint is also examined by performing solid
state isothermal aging at 125˚C and 150˚C for up to 2000 hours. The results revealed that after reflow
soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment
another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time and
temperature of solder joints results in an increase of IMC’s thickness and changes their morphologies
to become more spherical, dense and with larger grain size. In addition, the results also revealed that
the thickness of intermetallics formed is proportional to the aging duration and temperature.
|
| format |
Article |
| author |
Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Azmah Hanim, Mohamad Ariff |
| author_facet |
Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Azmah Hanim, Mohamad Ariff |
| author_sort |
Siti Rabiatull Aisha, Idris |
| title |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| title_short |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| title_full |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| title_fullStr |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| title_full_unstemmed |
Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish |
| title_sort |
effect of different aging temperatures on interfacial reaction between sac305 and enepig surface finish |
| publisher |
Trans Tech Publications, Switzerland |
| publishDate |
2012 |
| url |
http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/ http://umpir.ump.edu.my/id/eprint/5202/1/AMR_from_kak_ija.pdf |
| first_indexed |
2023-09-18T22:00:27Z |
| last_indexed |
2023-09-18T22:00:27Z |
| _version_ |
1777414363329593344 |