Showing 1 - 8 results of 8 for search 'Ali, Ourdjini', query time: 0.04s Refine Results
  1. 1
    Effect of Multiple Reflow on IMC Formation using Various Surface Finishes
    Get full text
    Get full text
    Get full text
  2. 2
    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
    Get full text
    Get full text
    Get full text
  3. 3
    Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper
    Get full text
    Get full text
    Get full text
  4. 4
    Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
    Get full text
    Get full text
    Get full text
    Get full text
  5. 5
    Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate
    Get full text
    Get full text
    Get full text
    Get full text
  6. 6
    Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
    Get full text
    Get full text
    Get full text
    Get full text
  7. 7
    Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
    Get full text
    Get full text
    Get full text
  8. 8
    Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish
    Get full text
    Get full text
    Get full text
    Get full text
Search Tools: RSS Feed – Email Search