Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman
Published 2015

Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2015

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris
Published 2013

Effect of Reflow Soldering Profile on Intermetallic Compound Formation

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2015

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
Published 2015

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman
Published 2013

Effect of Different Aging Temperatures on Interfacial Reaction between SAC305 and ENEPIG Surface Finish

by Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Azmah Hanim, Mohamad Ariff
Published 2012

Effect of Reflow Profile on Intermetallic Compound Formation

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2013