Effect of Nickel Doping on Interfacial Reaction between Lead-free Solder and Ni-P Substrate
Due to environmental concern, lead-free solder are taking the place of eutectic Sn-Pb solder in electronic packaging industry. Among various lead free alloys, Sn–Ag–Cu (SAC) alloys are leading lead-free candidate solders for various applications because it is offered better properties. This study in...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2012
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/5192/ http://umpir.ump.edu.my/id/eprint/5192/ http://umpir.ump.edu.my/id/eprint/5192/ http://umpir.ump.edu.my/id/eprint/5192/2/AMR.488-489.1375_from_kak_Ija_2012.pdf |