Effect of Reflow Soldering Profile on Intermetallic Compound Formation

Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation a...

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Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format:	Article
Language:	English English
Published:	Inderscience 2015
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf

id	ump-11731
recordtype	eprints
spelling	ump-117312018-01-15T07:45:26Z http://umpir.ump.edu.my/id/eprint/11731/ Effect of Reflow Soldering Profile on Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TA Engineering (General). Civil engineering (General) Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation and growth. Several techniques of materials characterisation including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis were used to characterise the intermetallics. Besides, the effects of cooling rate and isothermal ageing were also studied. In summary, reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have an effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal ageing. However, further research can be carried out to determine the solder joint’s strength produced by both reflow soldering profiles. Inderscience 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2015) Effect of Reflow Soldering Profile on Intermetallic Compound Formation. International Journal of Computer Applications in Technology, 52 (4). pp. 244-250. ISSN 0952-8091 (print); 1741-5047 (online) http://dx.doi.org/10.1504/IJCAT.2015.073590 DOI: 10.1504/IJCAT.2015.073590
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	TA Engineering (General). Civil engineering (General)
spellingShingle	TA Engineering (General). Civil engineering (General) Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman Effect of Reflow Soldering Profile on Intermetallic Compound Formation
description	Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation and growth. Several techniques of materials characterisation including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis were used to characterise the intermetallics. Besides, the effects of cooling rate and isothermal ageing were also studied. In summary, reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have an effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal ageing. However, further research can be carried out to determine the solder joint’s strength produced by both reflow soldering profiles.
format	Article
author	Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman
author_facet	Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman
author_sort	Siti Rabiatull Aisha, Idris
title	Effect of Reflow Soldering Profile on Intermetallic Compound Formation
title_short	Effect of Reflow Soldering Profile on Intermetallic Compound Formation
title_full	Effect of Reflow Soldering Profile on Intermetallic Compound Formation
title_fullStr	Effect of Reflow Soldering Profile on Intermetallic Compound Formation
title_full_unstemmed	Effect of Reflow Soldering Profile on Intermetallic Compound Formation
title_sort	effect of reflow soldering profile on intermetallic compound formation
publisher	Inderscience
publishDate	2015
url	http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf
first_indexed	2023-09-18T22:12:41Z
last_indexed	2023-09-18T22:12:41Z
_version_	1777415132358377472

Effect of Reflow Soldering Profile on Intermetallic Compound Formation

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