Effect of Reflow Soldering Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process in surface mount technology assembly since it can increase solder joint reliability. The present study investigated the effect of different reflow soldering atmospheres, either air or nitrogen, on intermetallic compound (IMC) formation a...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English English |
| Published: |
Inderscience
2015
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/ http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf |
Internet
http://umpir.ump.edu.my/id/eprint/11731/http://umpir.ump.edu.my/id/eprint/11731/
http://umpir.ump.edu.my/id/eprint/11731/
http://umpir.ump.edu.my/id/eprint/11731/1/IJCAT%2052%284%29%20Paper%206_2015.pdf
http://umpir.ump.edu.my/id/eprint/11731/7/Effect%20of%20reflow%20soldering%20profile%20on%20intermetallic%20compound%20formation.pdf