Modelling and optimization of copper electroplating adhesion strength
In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion stre...
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Institute of Physics
2017
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iium-557782019-08-18T04:30:54Z http://irep.iium.edu.my/55778/ Modelling and optimization of copper electroplating adhesion strength -, Suryanto Haider, Farag Ani, Mohd Hanafi Mahmood, Mahmood Hameed TA401 Materials of engineering and construction In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of CuSO4 100 to 200 g/ L, H2SO4 100 to 200 g / L and current density 40 to 80 mA / cm2. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 mA/cm2, to obtain the maximum adhesion strength 10N. Institute of Physics 2017-01 Article PeerReviewed application/pdf en http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf application/pdf en http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf application/pdf en http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf -, Suryanto and Haider, Farag and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Modelling and optimization of copper electroplating adhesion strength. IOP Conference Series: Materials Science and Engineering, 204 (012017). pp. 1-5. ISSN 1757-899X http://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017/pdf |
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TA401 Materials of engineering and construction -, Suryanto Haider, Farag Ani, Mohd Hanafi Mahmood, Mahmood Hameed Modelling and optimization of copper electroplating adhesion strength |
description |
In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of CuSO4 100 to 200 g/ L, H2SO4 100 to 200 g / L and current density 40 to 80 mA / cm2. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 mA/cm2, to obtain the maximum adhesion strength 10N. |
format |
Article |
author |
-, Suryanto Haider, Farag Ani, Mohd Hanafi Mahmood, Mahmood Hameed |
author_facet |
-, Suryanto Haider, Farag Ani, Mohd Hanafi Mahmood, Mahmood Hameed |
author_sort |
-, Suryanto |
title |
Modelling and optimization of copper electroplating adhesion strength |
title_short |
Modelling and optimization of copper electroplating adhesion strength |
title_full |
Modelling and optimization of copper electroplating adhesion strength |
title_fullStr |
Modelling and optimization of copper electroplating adhesion strength |
title_full_unstemmed |
Modelling and optimization of copper electroplating adhesion strength |
title_sort |
modelling and optimization of copper electroplating adhesion strength |
publisher |
Institute of Physics |
publishDate |
2017 |
url |
http://irep.iium.edu.my/55778/ http://irep.iium.edu.my/55778/ http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf |
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2023-09-18T21:18:44Z |
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2023-09-18T21:18:44Z |
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