Modelling and optimization of copper electroplating adhesion strength

In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion stre...

Full description

Bibliographic Details
Main Authors: -, Suryanto, Haider, Farag, Ani, Mohd Hanafi, Mahmood, Mahmood Hameed
Format: Article
Language:English
English
English
Published: Institute of Physics 2017
Subjects:
Online Access:http://irep.iium.edu.my/55778/
http://irep.iium.edu.my/55778/
http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf
http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf
http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf
id iium-55778
recordtype eprints
spelling iium-557782019-08-18T04:30:54Z http://irep.iium.edu.my/55778/ Modelling and optimization of copper electroplating adhesion strength -, Suryanto Haider, Farag Ani, Mohd Hanafi Mahmood, Mahmood Hameed TA401 Materials of engineering and construction In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of CuSO4 100 to 200 g/ L, H2SO4 100 to 200 g / L and current density 40 to 80 mA / cm2. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 mA/cm2, to obtain the maximum adhesion strength 10N. Institute of Physics 2017-01 Article PeerReviewed application/pdf en http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf application/pdf en http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf application/pdf en http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf -, Suryanto and Haider, Farag and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Modelling and optimization of copper electroplating adhesion strength. IOP Conference Series: Materials Science and Engineering, 204 (012017). pp. 1-5. ISSN 1757-899X http://iopscience.iop.org/article/10.1088/1757-899X/204/1/012017/pdf
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
English
English
topic TA401 Materials of engineering and construction
spellingShingle TA401 Materials of engineering and construction
-, Suryanto
Haider, Farag
Ani, Mohd Hanafi
Mahmood, Mahmood Hameed
Modelling and optimization of copper electroplating adhesion strength
description In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO4 and H2SO4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation can be used to predict the adhesion strength of the copper coatings on stainless steel substrate of electroplating parameters in ranges of CuSO4 100 to 200 g/ L, H2SO4 100 to 200 g / L and current density 40 to 80 mA / cm2. The results showed that, operating condition should be controlled at 200 g/L CuSO4, 100 g/L H2SO4 and 80 mA/cm2, to obtain the maximum adhesion strength 10N.
format Article
author -, Suryanto
Haider, Farag
Ani, Mohd Hanafi
Mahmood, Mahmood Hameed
author_facet -, Suryanto
Haider, Farag
Ani, Mohd Hanafi
Mahmood, Mahmood Hameed
author_sort -, Suryanto
title Modelling and optimization of copper electroplating adhesion strength
title_short Modelling and optimization of copper electroplating adhesion strength
title_full Modelling and optimization of copper electroplating adhesion strength
title_fullStr Modelling and optimization of copper electroplating adhesion strength
title_full_unstemmed Modelling and optimization of copper electroplating adhesion strength
title_sort modelling and optimization of copper electroplating adhesion strength
publisher Institute of Physics
publishDate 2017
url http://irep.iium.edu.my/55778/
http://irep.iium.edu.my/55778/
http://irep.iium.edu.my/55778/1/Modelling%20and%20Optimization.pdf
http://irep.iium.edu.my/55778/7/55778_Modelling%20and%20Optimization%20of%20Copper_SCOPUS.pdf
http://irep.iium.edu.my/55778/13/55778%20Modelling%20and%20optimization%20of%20copper%20electroplating%20WOS.pdf
first_indexed 2023-09-18T21:18:44Z
last_indexed 2023-09-18T21:18:44Z
_version_ 1777411738818314240