Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adh...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2017
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/1/AMM.864.121.pdf |