Microstructure Evolution at the Solder Joint During Isothermal Aging
The intermetallic compound formation and growth between Sn-3.0Ag-0.5Cu solder and surface finish, mainly immersion Au-plated Cu and immersion Sn-plated Cu were investigated in this study. This study aimed to examine the effect of different immersion types of surface finish towards the intermetallic...
| Main Authors: | , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
IEEE
2014
|
| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/9507/ http://umpir.ump.edu.my/id/eprint/9507/ http://umpir.ump.edu.my/id/eprint/9507/1/fkm-2014-aisha-Microstructure%20Evolution%20at%20the%20Solder.pdf |