Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish

The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates...

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Main Authors:	Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman, Ali, Ourdjini, Astuty, Amrin
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2014
Subjects:	T Technology (General) TN Mining engineering. Metallurgy
Online Access:	http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf

id	ump-5201
recordtype	eprints
spelling	ump-52012018-01-15T07:48:19Z http://umpir.ump.edu.my/id/eprint/5201/ Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin T Technology (General) TN Mining engineering. Metallurgy The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders. Trans Tech Publications, Switzerland 2014 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman and Ali, Ourdjini and Astuty, Amrin (2014) Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish. Advanced Materials Research, 845. pp. 76-80. ISSN 1022-6680 (print), 1662-8985 (online) http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76 DOI: http://dx.doi.org/10.4028/www.scientific.net/AMR.845.76
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	T Technology (General) TN Mining engineering. Metallurgy
spellingShingle	T Technology (General) TN Mining engineering. Metallurgy Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
description	The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates the interfacial reactions during reflow soldering and isothermal aging between Sn4.0Ag-0.5Cu (SAC405) and electroless nickel (boron)/ immersion palladium/immersion gold (EN(B)EPIG). Reliability of solder joint has also been investigated by performing solid state isothermal aging at 125˚C for up to 2000 hours. The results revealed that after reflow soldering, (Cu, Ni)6Sn5 IMC is formed between solder and substrate while after aging treatment another IMC was found between (Cu, Ni)6Sn5 and substrate known as (Ni, Cu)3Sn4. Aging time of solder joints resulted in an increase in IMC thickness and a change in morphology into more spherical, dense and with larger grain size. By using optical microscope, the average thickness of the intermetallics was measured and it found that the larger solder balls produced thicker IMC than the smaller solder balls during reflow soldering. However, after aging the smaller solders produced thicker IMC than the larger solders.
format	Article
author	Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin
author_facet	Siti Rabiatull Aisha, Idris Saliza Azlina, Osman Ali, Ourdjini Astuty, Amrin
author_sort	Siti Rabiatull Aisha, Idris
title	Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
title_short	Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
title_full	Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
title_fullStr	Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
title_full_unstemmed	Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
title_sort	effect of solder volume on interfacial reaction between sac405 solders and en(b)epig surface finish
publisher	Trans Tech Publications, Switzerland
publishDate	2014
url	http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf
first_indexed	2023-09-18T22:00:27Z
last_indexed	2023-09-18T22:00:27Z
_version_	1777414363182792704

Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish

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