Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes

Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes

In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMC) formation of solder joints made from lead-free Sn-4Ag-0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG),...

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Main Authors: Siti Rabiatull Aisha, Idris, Ali, Ourdjini, Saliza Azlina, Osman
Format: Article
Language:English
Published: Inderscience Enterprises Ltd. 2011
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/1/fkm-2011-rabiatull-EffectOfMultiple.pdf
id ump-5191
recordtype eprints
spelling ump-51912018-01-15T08:24:43Z http://umpir.ump.edu.my/id/eprint/5191/ Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes Siti Rabiatull Aisha, Idris Ali, Ourdjini Saliza Azlina, Osman TJ Mechanical engineering and machinery In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMC) formation of solder joints made from lead-free Sn-4Ag-0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and Copper surface finishes are presented. After the first reflow soldering, the well-known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. With increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that, the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used. Inderscience Enterprises Ltd. 2011 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5191/1/fkm-2011-rabiatull-EffectOfMultiple.pdf Siti Rabiatull Aisha, Idris and Ali, Ourdjini and Saliza Azlina, Osman (2011) Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes. International Journal of Microstructure and Materials Properties, 7 (6). pp. 502-516. ISSN 1741-8410 (print); 1741-8429 (online) http://dx.doi.org/10.1504/IJMMP.2012.051230 DOI: 10.1504/IJMMP.2012.051230
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Siti Rabiatull Aisha, Idris
Ali, Ourdjini
Saliza Azlina, Osman
Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
description In this paper, the results of a study on the effect of multiple reflow on the mechanism of intermetallic compounds (IMC) formation of solder joints made from lead-free Sn-4Ag-0.5Cu (SAC405) on electroless nickel/electroless palladium/immersion gold (ENEPIG), electroless nickel/immersion gold (ENIG), immersion silver (ImAg) and Copper surface finishes are presented. After the first reflow soldering, the well-known intermetallic Cu6Sn5 was observed in ImAg and Copper of surface finishes. While for ENEPIG and ENIG, mainly, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was formed respectively. With increasing the number of reflows up to three, the thickness of intermetallics increased gradually and their grain sizes coarsened. The intermetallics growth kinetics showed that the interfacial phase Cu6Sn5, (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 was controlled mainly by grain boundary diffusion and that, the intermetallic growth on ENEPIG was found to be slowest among other surface finishes being used.
format Article
author Siti Rabiatull Aisha, Idris
Ali, Ourdjini
Saliza Azlina, Osman
author_facet Siti Rabiatull Aisha, Idris
Ali, Ourdjini
Saliza Azlina, Osman
author_sort Siti Rabiatull Aisha, Idris
title Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
title_short Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
title_full Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
title_fullStr Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
title_full_unstemmed Effect of Multiple Reflow on Intermetallic Compound Formation using Various Surface Finishes
title_sort effect of multiple reflow on intermetallic compound formation using various surface finishes
publisher Inderscience Enterprises Ltd.
publishDate 2011
url http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/
http://umpir.ump.edu.my/id/eprint/5191/1/fkm-2011-rabiatull-EffectOfMultiple.pdf
first_indexed 2023-09-18T22:00:26Z
last_indexed 2023-09-18T22:00:26Z
_version_ 1777414361868926976

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