Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

Reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) s...

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Main Authors:	Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman
Format:	Article
Language:	English
Published:	Universiti Malaysia Pahang 2013
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://umpir.ump.edu.my/id/eprint/4004/ http://umpir.ump.edu.my/id/eprint/4004/ http://umpir.ump.edu.my/id/eprint/4004/1/P184.pdf

id	ump-4004
recordtype	eprints
spelling	ump-40042018-01-15T08:10:01Z http://umpir.ump.edu.my/id/eprint/4004/ Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers Siti Rabiatull Aisha, Idris Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman TK Electrical engineering. Electronics Nuclear engineering Reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. Few of the parameters are solder type, thickness of nickel layer and aging time. The results focused on type of intermetallic compound formed and the intermetallic thickness. Aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, nickel thickness 3micrometer is adequate to be a good diffusion barrier up to 2000hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic start after 500hour Universiti Malaysia Pahang 2013 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/4004/1/P184.pdf Siti Rabiatull Aisha, Idris and Azmah Hanim, Mohamad Ariff and Ourdjini, Ali and Saliza Azlina, Osman (2013) Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers. International Journal of Automotive and Mechanical Engineering (IJAME), 8. pp. 1348-1356. ISSN 1985-9325(Print); 2180-1606 (Online) http://ijame.ump.edu.my/images/Volume_8/22_Azmah%20Hanim%20et%20al.%20s.pdf
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TK Electrical engineering. Electronics Nuclear engineering
spellingShingle	TK Electrical engineering. Electronics Nuclear engineering Siti Rabiatull Aisha, Idris Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
description	Reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. Few of the parameters are solder type, thickness of nickel layer and aging time. The results focused on type of intermetallic compound formed and the intermetallic thickness. Aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, nickel thickness 3micrometer is adequate to be a good diffusion barrier up to 2000hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic start after 500hour
format	Article
author	Siti Rabiatull Aisha, Idris Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman
author_facet	Siti Rabiatull Aisha, Idris Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman
author_sort	Siti Rabiatull Aisha, Idris
title	Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
title_short	Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
title_full	Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
title_fullStr	Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
title_full_unstemmed	Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers
title_sort	intermetallic evolution for isothermal aging up to 2000hours on sn-4ag-0.5cu and sn-37pb solders with ni/au layers
publisher	Universiti Malaysia Pahang
publishDate	2013
url	http://umpir.ump.edu.my/id/eprint/4004/ http://umpir.ump.edu.my/id/eprint/4004/ http://umpir.ump.edu.my/id/eprint/4004/1/P184.pdf
first_indexed	2023-09-18T21:58:33Z
last_indexed	2023-09-18T21:58:33Z
_version_	1777414243153346560

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

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