Effect of Reflow Profile on Intermetallic Compound Formation

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So f...

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Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Format:	Article
Language:	English English
Published:	IOP Publishing 2013
Subjects:	TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf

id	ump-3549
recordtype	eprints
spelling	ump-35492018-01-15T08:08:51Z http://umpir.ump.edu.my/id/eprint/3549/ Effect of Reflow Profile on Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman TS Manufactures Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes on the reliability of lead-free solder joints. While the effects of reflow conditions on intermetallic compound (IMC) formation at the solder joint such as the atmosphere during the reflow process are still unclear. The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth. Several techniques of materials characterization including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis will be used to characterise the intermetallics in terms of composition, thickness and morphology. In addition, the effects of cooling rate and isothermal aging were also studied for the solder alloy Sn–4Ag–0.5Cu on electroless nickel/immersion gold (ENIG) surface finish. From the study, it was found that reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have a significant effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal aging. IOP Publishing 2013 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Azmah Hanim, Mohamad Ariff and Saliza Azlina, Osman (2013) Effect of Reflow Profile on Intermetallic Compound Formation. IOP Conference Series: Materials Science and Engineering, 46. pp. 1-8. ISSN 1757-8981 (Print), 1757-899X (Online) http://dx.doi.org/10.1016/j.clnme.2012.05.002 DOI: 10.1016/j.clnme.2012.05.002
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	TS Manufactures
spellingShingle	TS Manufactures Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman Effect of Reflow Profile on Intermetallic Compound Formation
description	Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes on the reliability of lead-free solder joints. While the effects of reflow conditions on intermetallic compound (IMC) formation at the solder joint such as the atmosphere during the reflow process are still unclear. The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth. Several techniques of materials characterization including optical, image analysis, scanning electron microscopy and energy dispersive X-ray analysis will be used to characterise the intermetallics in terms of composition, thickness and morphology. In addition, the effects of cooling rate and isothermal aging were also studied for the solder alloy Sn–4Ag–0.5Cu on electroless nickel/immersion gold (ENIG) surface finish. From the study, it was found that reflowing under nitrogen atmosphere had better effect on IMC formation and growth compared to reflowing under air. Besides, the cooling rate of solder during reflow also appears to have a significant effect on the final structure of the solder joint, and controlling the growth behaviour of the IMC during subsequent isothermal aging.
format	Article
author	Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman
author_facet	Siti Rabiatull Aisha, Idris Ourdjini, Ali Azmah Hanim, Mohamad Ariff Saliza Azlina, Osman
author_sort	Siti Rabiatull Aisha, Idris
title	Effect of Reflow Profile on Intermetallic Compound Formation
title_short	Effect of Reflow Profile on Intermetallic Compound Formation
title_full	Effect of Reflow Profile on Intermetallic Compound Formation
title_fullStr	Effect of Reflow Profile on Intermetallic Compound Formation
title_full_unstemmed	Effect of Reflow Profile on Intermetallic Compound Formation
title_sort	effect of reflow profile on intermetallic compound formation
publisher	IOP Publishing
publishDate	2013
url	http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/ http://umpir.ump.edu.my/id/eprint/3549/1/169_Siti_Rabiatull_Aisha_Idris_MOIME2013.pdf http://umpir.ump.edu.my/id/eprint/3549/2/1757-899X_46_1_012037_2.pdf
first_indexed	2023-09-18T21:57:55Z
last_indexed	2023-09-18T21:57:55Z
_version_	1777414203161706496

Effect of Reflow Profile on Intermetallic Compound Formation

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