Effect of electroless nickel-boron (EN-B) surface finish on solderability of SAC305 and solder joint strength
Rapid developments in technology have been a great challenge for the electronics industry to keep up with the industrial requirement to provide cost-effective smart devices while, at the same time, maintaining their quality. The quality of electronic packaging is directly related to the solder joint...
Internet
http://umpir.ump.edu.my/id/eprint/19758/http://umpir.ump.edu.my/id/eprint/19758/
http://umpir.ump.edu.my/id/eprint/19758/1/Effect%20of%20electroless%20nickel-boron%20%28EN-B%29%20surface%20finish%20on%20solderability%20of%20SAC305%20and%20solder%20joint%20strength%20-Table%20of%20contents.pdf
http://umpir.ump.edu.my/id/eprint/19758/2/Effect%20of%20electroless%20nickel-boron%20%28EN-B%29%20surface%20finish%20on%20solderability%20of%20SAC305%20and%20solder%20joint%20strength%20-Abstract.pdf
http://umpir.ump.edu.my/id/eprint/19758/9/Effect%20of%20electroless%20nickel-boron%20%28EN-B%29%20surface%20finish%20on%20solderability%20of%20SAC305%20and%20solder%20joint%20strength%20-References.pdf