Effect of Flux onto Intermetallic Compound Formation and Growth
In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn 3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C...
| Main Authors: | , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
EDP Sciences
2016
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/ http://umpir.ump.edu.my/id/eprint/14487/6/fkm-2016-aisha-effect%20of%20flux.pdf |