Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow

Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluat...

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Main Authors:	Siti Rabiatull Aisha, Idris, Siti, Zuleikha, Zetty Akhtar, Abd Malek
Format:	Conference or Workshop Item
Language:	English English
Published:	EDP Sciences 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf

id	ump-14390
recordtype	eprints
spelling	ump-143902018-01-15T07:36:54Z http://umpir.ump.edu.my/id/eprint/14390/ Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek TJ Mechanical engineering and machinery Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC) found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength. EDP Sciences 2016 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf Siti Rabiatull Aisha, Idris and Siti, Zuleikha and Zetty Akhtar, Abd Malek (2016) Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow. In: MATEC Web of Conferences: The 3rd International Conference on Mechanical Engineering Research (ICMER 2015), 18-19 August 2015 , Zenith Hotel, Kuantan, Pahang, Malaysia. pp. 1-5., 74 (00038). ISSN 2261-236X http://dx.doi.org/10.1051/matecconf/20167400038
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
description	Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC) found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.
format	Conference or Workshop Item
author	Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek
author_facet	Siti Rabiatull Aisha, Idris Siti, Zuleikha Zetty Akhtar, Abd Malek
author_sort	Siti Rabiatull Aisha, Idris
title	Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
title_short	Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
title_full	Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
title_fullStr	Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
title_full_unstemmed	Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
title_sort	wettability study of lead free solder paste and its effect towards multiple reflow
publisher	EDP Sciences
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf
first_indexed	2023-09-18T22:18:05Z
last_indexed	2023-09-18T22:18:05Z
_version_	1777415472361242624

Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow

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