Wettability Study of Lead Free Solder Paste and its Effect Towards Multiple Reflow
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluat...
| Main Authors: | , , |
|---|---|
| Format: | Conference or Workshop Item |
| Language: | English English |
| Published: |
EDP Sciences
2016
|
| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/ http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf |
Internet
http://umpir.ump.edu.my/id/eprint/14390/http://umpir.ump.edu.my/id/eprint/14390/
http://umpir.ump.edu.my/id/eprint/14390/1/Wettability%20Study%20Of%20Lead%20Free%20Solder%20Paste%20And%20Its%20Effect%20Towards%20Multiple%20Reflow.pdf
http://umpir.ump.edu.my/id/eprint/14390/7/fkm-2016-aisha-wettability%20study%20of%20lead%20free.pdf