Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

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Main Authors: Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
Format: Conference or Workshop Item
Language:English
English
Published: 2015
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/11780/
http://umpir.ump.edu.my/id/eprint/11780/
http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf
http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf
id ump-11780
recordtype eprints
spelling ump-117802018-01-11T08:15:38Z http://umpir.ump.edu.my/id/eprint/11780/ Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes Azmah Hanim, Mohamad Ariff Ourdjini, Ali Siti Rabiatull Aisha, Idris Saliza Azlina, Osman TJ Mechanical engineering and machinery In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focus on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Optical microscope and FESEM (Field emission scanning electron microscope) were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni)6Sn5 to (Ni, Cu)3Sn4 after 1000 thermal cycles for Ni/Au. This changes promotes the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. Showing that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment. 2015 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf Azmah Hanim, Mohamad Ariff and Ourdjini, Ali and Siti Rabiatull Aisha, Idris and Saliza Azlina, Osman (2015) Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes. In: International Conference On Mechanical Engineering Research (ICMER) 2015, 18-19 August 2015 , Kuantan, Pahang. . http://eprints.uthm.edu.my/7233/
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Siti Rabiatull Aisha, Idris
Saliza Azlina, Osman
Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
description In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focus on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Optical microscope and FESEM (Field emission scanning electron microscope) were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni)6Sn5 to (Ni, Cu)3Sn4 after 1000 thermal cycles for Ni/Au. This changes promotes the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. Showing that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment.
format Conference or Workshop Item
author Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Siti Rabiatull Aisha, Idris
Saliza Azlina, Osman
author_facet Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Siti Rabiatull Aisha, Idris
Saliza Azlina, Osman
author_sort Azmah Hanim, Mohamad Ariff
title Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
title_short Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
title_full Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
title_fullStr Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
title_full_unstemmed Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes
title_sort thermal cyclic test for sn-4ag-0.5cu solders on high p ni/au and ni/pd/au surface finishes
publishDate 2015
url http://umpir.ump.edu.my/id/eprint/11780/
http://umpir.ump.edu.my/id/eprint/11780/
http://umpir.ump.edu.my/id/eprint/11780/1/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes.pdf
http://umpir.ump.edu.my/id/eprint/11780/7/Thermal%20Cyclic%20Test%20For%20Sn-4Ag-0.5Cu%20Solders%20On%20High%20P%20Ni-Au%20AND%20Ni-Pd-Au%20Surface%20Finishes-abstract.pdf
first_indexed 2023-09-18T22:12:44Z
last_indexed 2023-09-18T22:12:44Z
_version_ 1777415136162611200

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