Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/...

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Bibliographic Details
Main Authors: Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris
Format: Article
Language:English
Published: Universiti Malaysia Pahang 2013
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/10991/
http://umpir.ump.edu.my/id/eprint/10991/
http://umpir.ump.edu.my/id/eprint/10991/
http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf

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