Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/...

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Main Authors:	Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris
Format:	Article
Language:	English
Published:	Universiti Malaysia Pahang 2013
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf

id	ump-10991
recordtype	eprints
spelling	ump-109912018-01-11T08:19:37Z http://umpir.ump.edu.my/id/eprint/10991/ Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Siti Rabiatull Aisha, Idris TJ Mechanical engineering and machinery The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. The parameters include the solder type, thickness of the nickel layer and aging time. The results are focused on the type of intermetallic compound formed and the intermetallic thickness. Overall, aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, a nickel thickness of 3µm is adequate to be a good diffusion barrier up to 2000 hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic starts after 500 hours until 2000 hours. Universiti Malaysia Pahang 2013 Article PeerReviewed application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf Azmah Hanim, Mohamad Ariff and Ourdjini, Ali and Saliza Azlina, Osman and Siti Rabiatull Aisha, Idris (2013) Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers. International Journal of Automotive and Mechanical Engineering (IJAME), 8. pp. 1348-1356. ISSN 1985-9325(Print); 2180-1606 (Online) http://dx.doi.org/10.15282/ijame.8.2013.22.0110 DOI: 10.15282/ijame.8.2013.22.0110
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Siti Rabiatull Aisha, Idris Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
description	The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. The parameters include the solder type, thickness of the nickel layer and aging time. The results are focused on the type of intermetallic compound formed and the intermetallic thickness. Overall, aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, a nickel thickness of 3µm is adequate to be a good diffusion barrier up to 2000 hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic starts after 500 hours until 2000 hours.
format	Article
author	Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Siti Rabiatull Aisha, Idris
author_facet	Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Siti Rabiatull Aisha, Idris
author_sort	Azmah Hanim, Mohamad Ariff
title	Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_short	Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_full	Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_fullStr	Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_full_unstemmed	Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_sort	intermetallic evolution for isothermal aging up to 2000 hours on sn-4ag-0.5cu and sn-37pb solders with ni/au layers
publisher	Universiti Malaysia Pahang
publishDate	2013
url	http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/ http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf
first_indexed	2023-09-18T22:11:15Z
last_indexed	2023-09-18T22:11:15Z
_version_	1777415042338127872

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

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