Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6 Sn5 and Cu Sn. The growth of Cu6 Sn5 and Cu Sn intermetallics have been invest...
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| Format: | Article |
| Language: | English |
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Research Management Institute (RMI)
2010
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| Online Access: | http://ir.uitm.edu.my/id/eprint/12940/ http://ir.uitm.edu.my/id/eprint/12940/1/AJ_RAMANI%20MAYAPPAN%20SRJ%2010%201.pdf |