Experimental and numerical analysis of electronics heat sink

Cooling of electronic components continues to attract many research and development activities towards achieving an effective way of cooling. Computational fluid dynamics (CFD) tools may be considered as a cheap substitute for expensive experimental testing methods. In this work the cooling of a sim...

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Main Authors:	Ismail, Ahmad Faris, Ahmed, Mirghani Ishak, Abakrb, Yousif A.
Format:	Article
Language:	English
Published:	IIUM Press 2002
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/1/IIUM_Journal_Heat_Sink_2002.pdf

id	iium-36908
recordtype	eprints
spelling	iium-369082014-06-11T03:22:38Z http://irep.iium.edu.my/36908/ Experimental and numerical analysis of electronics heat sink Ismail, Ahmad Faris Ahmed, Mirghani Ishak Abakrb, Yousif A. TJ Mechanical engineering and machinery Cooling of electronic components continues to attract many research and development activities towards achieving an effective way of cooling. Computational fluid dynamics (CFD) tools may be considered as a cheap substitute for expensive experimental testing methods. In this work the cooling of a simulated electronic board was modeled using FLUENTTM CFD software, and experimental procedures were followed to validate the estimated results, and to understand the factors that would affect the software capability to predict the actual measured values. Results showed good agreement between the simulation and experimental results. The software was found to be capable to predict the exact values at the locations where the temperature values were similar to the board mean temperature. The maximum percentage error was found to be limited to 4.7%, and the capability of the software to estimate the exact measured values was found to be affected by the function of thermal wake generation. IIUM Press 2002 Article PeerReviewed application/pdf en http://irep.iium.edu.my/36908/1/IIUM_Journal_Heat_Sink_2002.pdf Ismail, Ahmad Faris and Ahmed, Mirghani Ishak and Abakrb, Yousif A. (2002) Experimental and numerical analysis of electronics heat sink. IIUM Engineering Journal, 3 (2). pp. 17-32. ISSN 1511-788X http://journals.iium.edu.my/ejournal/index.php/iiumej/article/view/362
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Ismail, Ahmad Faris Ahmed, Mirghani Ishak Abakrb, Yousif A. Experimental and numerical analysis of electronics heat sink
description	Cooling of electronic components continues to attract many research and development activities towards achieving an effective way of cooling. Computational fluid dynamics (CFD) tools may be considered as a cheap substitute for expensive experimental testing methods. In this work the cooling of a simulated electronic board was modeled using FLUENTTM CFD software, and experimental procedures were followed to validate the estimated results, and to understand the factors that would affect the software capability to predict the actual measured values. Results showed good agreement between the simulation and experimental results. The software was found to be capable to predict the exact values at the locations where the temperature values were similar to the board mean temperature. The maximum percentage error was found to be limited to 4.7%, and the capability of the software to estimate the exact measured values was found to be affected by the function of thermal wake generation.
format	Article
author	Ismail, Ahmad Faris Ahmed, Mirghani Ishak Abakrb, Yousif A.
author_facet	Ismail, Ahmad Faris Ahmed, Mirghani Ishak Abakrb, Yousif A.
author_sort	Ismail, Ahmad Faris
title	Experimental and numerical analysis of electronics heat sink
title_short	Experimental and numerical analysis of electronics heat sink
title_full	Experimental and numerical analysis of electronics heat sink
title_fullStr	Experimental and numerical analysis of electronics heat sink
title_full_unstemmed	Experimental and numerical analysis of electronics heat sink
title_sort	experimental and numerical analysis of electronics heat sink
publisher	IIUM Press
publishDate	2002
url	http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/1/IIUM_Journal_Heat_Sink_2002.pdf
first_indexed	2023-09-18T20:52:56Z
last_indexed	2023-09-18T20:52:56Z
_version_	1777410114977792000

Experimental and numerical analysis of electronics heat sink

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