MEMS and EFF technology based micro connector for future miniature devices
The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2013
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf |