Modeling of the reliability baseline for process control monitoring kerf structures

We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or tes...

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Main Authors:	Izuddin, Ismah, Kamaruddin, Mohd. Hanif, Nordin, Anis Nurashikin
Format:	Conference or Workshop Item
Language:	English
Published:	2011
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://irep.iium.edu.my/19885/ http://irep.iium.edu.my/19885/ http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf

id	iium-19885
recordtype	eprints
spelling	iium-198852012-02-17T07:40:09Z http://irep.iium.edu.my/19885/ Modeling of the reliability baseline for process control monitoring kerf structures Izuddin, Ismah Kamaruddin, Mohd. Hanif Nordin, Anis Nurashikin TA Engineering (General). Civil engineering (General) We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or test key) separating product die on the wafer. The motivation of this work is to establish the baseline of the dielectric and device reliability for the kerf PCM structure that will enhance the capability to perform lot disposition in the event of PCM test out-of-control (OOC). Different test structures will be stressed and correlation study is performed with existing models. The experiment was performed at Infineon Technologies Kulim Failure Analysis Lab and that test wafers were fabricated by Infineon Technologies. 2011-12-01 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf Izuddin, Ismah and Kamaruddin, Mohd. Hanif and Nordin, Anis Nurashikin (2011) Modeling of the reliability baseline for process control monitoring kerf structures. In: 2011 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 28-30 September, Kota Kinabalu, Malaysia. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6088327
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA Engineering (General). Civil engineering (General)
spellingShingle	TA Engineering (General). Civil engineering (General) Izuddin, Ismah Kamaruddin, Mohd. Hanif Nordin, Anis Nurashikin Modeling of the reliability baseline for process control monitoring kerf structures
description	We present the Product Chip Monitor-Wafer Level Reliability (PCM-WLR) model and characteristic of a 45nm thick gate-oxide (GOX), trench DMOS technology. The process control monitor (PCM) refers to the suite of test structures usually placed in the scribe line (alternatively named kerf, street or test key) separating product die on the wafer. The motivation of this work is to establish the baseline of the dielectric and device reliability for the kerf PCM structure that will enhance the capability to perform lot disposition in the event of PCM test out-of-control (OOC). Different test structures will be stressed and correlation study is performed with existing models. The experiment was performed at Infineon Technologies Kulim Failure Analysis Lab and that test wafers were fabricated by Infineon Technologies.
format	Conference or Workshop Item
author	Izuddin, Ismah Kamaruddin, Mohd. Hanif Nordin, Anis Nurashikin
author_facet	Izuddin, Ismah Kamaruddin, Mohd. Hanif Nordin, Anis Nurashikin
author_sort	Izuddin, Ismah
title	Modeling of the reliability baseline for process control monitoring kerf structures
title_short	Modeling of the reliability baseline for process control monitoring kerf structures
title_full	Modeling of the reliability baseline for process control monitoring kerf structures
title_fullStr	Modeling of the reliability baseline for process control monitoring kerf structures
title_full_unstemmed	Modeling of the reliability baseline for process control monitoring kerf structures
title_sort	modeling of the reliability baseline for process control monitoring kerf structures
publishDate	2011
url	http://irep.iium.edu.my/19885/ http://irep.iium.edu.my/19885/ http://irep.iium.edu.my/19885/1/Modeling_of_the_Reliability_Baseline_for_Process.pdf
first_indexed	2023-09-18T20:29:47Z
last_indexed	2023-09-18T20:29:47Z
_version_	1777408658612682752

Modeling of the reliability baseline for process control monitoring kerf structures

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