An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect

Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped be...

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Main Authors:	Faris, Waleed Fekry, Mohammed , H.M., Ng, Kok Heng
Format:	Conference or Workshop Item
Language:	English
Published:	2010
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf

id	iium-13426
recordtype	eprints
spelling	iium-134262012-01-18T00:18:47Z http://irep.iium.edu.my/13426/ An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng TA Engineering (General). Civil engineering (General) Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped beam actuated by a bottom electrode coated with dielectric film. Coupled field simulations between the thermal, structural and electrostatic fields were performed by using the multifield solver in ANSYS. The static responses of the beam under the temperature effects were obtained from this analysis. The analysis shows that the natural frequencies were decreased with the increasing of temperature and increasing in the cryogenic range. This study will provide the designers with a tool to optimize the geometry and performance of the microswitches operated under harsh temperature environment. 2010 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf Faris, Waleed Fekry and Mohammed , H.M. and Ng, Kok Heng (2010) An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect. In: 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP 2010), 5-7 May 2010, Seville, Spain. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5486507&tag=1
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA Engineering (General). Civil engineering (General)
spellingShingle	TA Engineering (General). Civil engineering (General) Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
description	Three dimensional multiphysics finite element analysis (FEA) was performed to investigate the static and dynamic responses of a micro-switch in harsh temperature environment. The temperature range for the analysis was from -60°C to 100°C. The investigated microswitch consists of a clamped-clamped beam actuated by a bottom electrode coated with dielectric film. Coupled field simulations between the thermal, structural and electrostatic fields were performed by using the multifield solver in ANSYS. The static responses of the beam under the temperature effects were obtained from this analysis. The analysis shows that the natural frequencies were decreased with the increasing of temperature and increasing in the cryogenic range. This study will provide the designers with a tool to optimize the geometry and performance of the microswitches operated under harsh temperature environment.
format	Conference or Workshop Item
author	Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng
author_facet	Faris, Waleed Fekry Mohammed , H.M. Ng, Kok Heng
author_sort	Faris, Waleed Fekry
title	An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
title_short	An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
title_full	An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
title_fullStr	An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
title_full_unstemmed	An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
title_sort	investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect
publishDate	2010
url	http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/ http://irep.iium.edu.my/13426/1/An_Investigation_of_the_Mechanical_Behavior_of_a_Microswitch.pdf
first_indexed	2023-09-18T20:22:36Z
last_indexed	2023-09-18T20:22:36Z
_version_	1777408206456225792

An investigation of the mechanical behavior of a microswitch beam under thermal and electrostatic loading including cryogenic effect

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