Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However, there is still in...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
scientific.net
2015
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf |