Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However, there is still in...

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Main Authors:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Article
Language:	English
Published:	scientific.net 2015
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf

id	ump-8576
recordtype	eprints
spelling	ump-85762018-01-15T06:58:19Z http://umpir.ump.edu.my/id/eprint/8576/ Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However, there is still insufficient study regarding the effect of cooling rate on the IMC thickness and microstructure behavior by using Nickel Boron as surface finish material in the electronic packaging industry. In this study, Sn-3Ag-0.5Cu solder was used on Nickel Boron as coating layer. Cooling rates were obtained by cooling specimens in different media which is water and air. The elemental composition was confirmed using Energy-dispersive X-ray spectroscopy and the microstructure of each IMC then analyzed using optical microscope, image analyzer and ImageJ. In this study, faster cooling rate (water) found to provide thicker IMC (6μm) compared to the other medium used. The morphology shape of each IMC also differs between different medium of cooling. IMC that undergoes faster cooling showed continues like layer while the one using air cooling formed scallop scientific.net 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/8576/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf Hardinnawirda, Kahar and Zetty Akhtar, Abd Malek and Siti Rabiatull Aisha, Idris and M., Ishak (2015) Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating. Applied Mechanics and Materials, 695. pp. 352-356. ISSN 1662-7482 http://www.scientific.net/AMM.695.352
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
description	This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However, there is still insufficient study regarding the effect of cooling rate on the IMC thickness and microstructure behavior by using Nickel Boron as surface finish material in the electronic packaging industry. In this study, Sn-3Ag-0.5Cu solder was used on Nickel Boron as coating layer. Cooling rates were obtained by cooling specimens in different media which is water and air. The elemental composition was confirmed using Energy-dispersive X-ray spectroscopy and the microstructure of each IMC then analyzed using optical microscope, image analyzer and ImageJ. In this study, faster cooling rate (water) found to provide thicker IMC (6μm) compared to the other medium used. The morphology shape of each IMC also differs between different medium of cooling. IMC that undergoes faster cooling showed continues like layer while the one using air cooling formed scallop
format	Article
author	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_facet	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_sort	Hardinnawirda, Kahar
title	Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
title_short	Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
title_full	Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
title_fullStr	Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
title_full_unstemmed	Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
title_sort	effect of cooling and isothermal aging on microstructure using electroless nickel (boron) plating
publisher	scientific.net
publishDate	2015
url	http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/ http://umpir.ump.edu.my/id/eprint/8576/1/Effect%20of%20Cooling%20and%20Isothermal%20Aging%20on%20Microstructure%20Using%20Electroless%20Nickel%20%28Boron%29%20Plating.pdf
first_indexed	2023-09-18T22:06:18Z
last_indexed	2023-09-18T22:06:18Z
_version_	1777414730775789568

Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

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