Effect of different cooling rate on integrated circuit (ic) package
Currently, electronic products have shrunk into smaller size and in order to increase the input/output (I/O) counts as well as to improve performance. The goal of this study is to determine the reliability and strength of the solder joint formed at the integrated circuit (IC) interconnection with th...
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| Format: | Undergraduates Project Papers |
| Language: | English |
| Published: |
2013
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| Online Access: | http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/1/CD8031_%40_56.pdf |