Effect of different cooling rate on integrated circuit (ic) package

Currently, electronic products have shrunk into smaller size and in order to increase the input/output (I/O) counts as well as to improve performance. The goal of this study is to determine the reliability and strength of the solder joint formed at the integrated circuit (IC) interconnection with th...

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Main Author:	Amir Syahmi, Nordin
Format:	Undergraduates Project Papers
Language:	English
Published:	2013
Subjects:	TK Electrical engineering. Electronics Nuclear engineering
Online Access:	http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/1/CD8031_%40_56.pdf

id	ump-8391
recordtype	eprints
spelling	ump-83912015-11-16T00:34:10Z http://umpir.ump.edu.my/id/eprint/8391/ Effect of different cooling rate on integrated circuit (ic) package Amir Syahmi, Nordin TK Electrical engineering. Electronics Nuclear engineering Currently, electronic products have shrunk into smaller size and in order to increase the input/output (I/O) counts as well as to improve performance. The goal of this study is to determine the reliability and strength of the solder joint formed at the integrated circuit (IC) interconnection with the board. The strength of the joint is based on the intermetallic compound (IMC) formation at the joint. Free lead based solders have been used nowadays due to the environmental and health hazard effect of the lead based solder. Two types of surface finish have been used in this study which was electroless/nickel immersion gold (ENIG) and bare copper substrate as the reference in the research. All specimens will be subjected to reflow soldering with slow and fast cooling rate apply on the sample. Then, all specimens will undergo isothermal ageing at 150°C for 250 hour and 500 hour. The IMC formed at the solder joints of all specimens were studied in terms of thickness and cooling rate applied on it. Characterization on the specimen is done by the cross section of the joint to see the IMC formation on the solder joint. It can be concluded that, the fast cooling rate forms large IMC compared to slow cooling rate which is much thinner than fast cooling rate. Besides that, it was found that IMCs thicknesses are proportional with ageing durations. However, thicker IMC was found on the bare copper substrate joint compare to ENIG surface joint after ageing treatment, indicating higher growth rate of IMCs formed at the bare cooper substrate 2013-06 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/8391/1/CD8031_%40_56.pdf Amir Syahmi, Nordin (2013) Effect of different cooling rate on integrated circuit (ic) package. Faculty of Mechanical Engineering , Universiti Malaysia Pahang. http://iportal.ump.edu.my/lib/item?id=chamo:83730&theme=UMP2
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TK Electrical engineering. Electronics Nuclear engineering
spellingShingle	TK Electrical engineering. Electronics Nuclear engineering Amir Syahmi, Nordin Effect of different cooling rate on integrated circuit (ic) package
description	Currently, electronic products have shrunk into smaller size and in order to increase the input/output (I/O) counts as well as to improve performance. The goal of this study is to determine the reliability and strength of the solder joint formed at the integrated circuit (IC) interconnection with the board. The strength of the joint is based on the intermetallic compound (IMC) formation at the joint. Free lead based solders have been used nowadays due to the environmental and health hazard effect of the lead based solder. Two types of surface finish have been used in this study which was electroless/nickel immersion gold (ENIG) and bare copper substrate as the reference in the research. All specimens will be subjected to reflow soldering with slow and fast cooling rate apply on the sample. Then, all specimens will undergo isothermal ageing at 150°C for 250 hour and 500 hour. The IMC formed at the solder joints of all specimens were studied in terms of thickness and cooling rate applied on it. Characterization on the specimen is done by the cross section of the joint to see the IMC formation on the solder joint. It can be concluded that, the fast cooling rate forms large IMC compared to slow cooling rate which is much thinner than fast cooling rate. Besides that, it was found that IMCs thicknesses are proportional with ageing durations. However, thicker IMC was found on the bare copper substrate joint compare to ENIG surface joint after ageing treatment, indicating higher growth rate of IMCs formed at the bare cooper substrate
format	Undergraduates Project Papers
author	Amir Syahmi, Nordin
author_facet	Amir Syahmi, Nordin
author_sort	Amir Syahmi, Nordin
title	Effect of different cooling rate on integrated circuit (ic) package
title_short	Effect of different cooling rate on integrated circuit (ic) package
title_full	Effect of different cooling rate on integrated circuit (ic) package
title_fullStr	Effect of different cooling rate on integrated circuit (ic) package
title_full_unstemmed	Effect of different cooling rate on integrated circuit (ic) package
title_sort	effect of different cooling rate on integrated circuit (ic) package
publishDate	2013
url	http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/ http://umpir.ump.edu.my/id/eprint/8391/1/CD8031_%40_56.pdf
first_indexed	2023-09-18T22:05:55Z
last_indexed	2023-09-18T22:05:55Z
_version_	1777414706741379072

Effect of different cooling rate on integrated circuit (ic) package

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