Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Add...

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Bibliographic Details
Main Authors: Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Conference or Workshop Item
Language:English
Published: 2014
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/6710/
http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF

Internet

http://umpir.ump.edu.my/id/eprint/6710/
http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF

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