A review on mechanical properties of SnAgCu/Cu joint using laser soldering
This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects to...
| Main Authors: | , , |
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| Format: | Book Section |
| Language: | English English |
| Published: |
Springer, Singapore
2018
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/24641/ http://umpir.ump.edu.my/id/eprint/24641/ http://umpir.ump.edu.my/id/eprint/24641/ http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf |