A review on mechanical properties of SnAgCu/Cu joint using laser soldering

A review on mechanical properties of SnAgCu/Cu joint using laser soldering

This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects to...

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Bibliographic Details
Main Authors: Nabila, Tamar Jaya, Siti Rabiatull Aisha, Idris, M., Ishak
Format: Book Section
Language:English
English
Published: Springer, Singapore 2018
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf
http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf
id ump-24641
recordtype eprints
spelling ump-246412019-04-15T06:22:01Z http://umpir.ump.edu.my/id/eprint/24641/ A review on mechanical properties of SnAgCu/Cu joint using laser soldering Nabila, Tamar Jaya Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings. Springer, Singapore 2018 Book Section PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf pdf en http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf Nabila, Tamar Jaya and Siti Rabiatull Aisha, Idris and M., Ishak (2018) A review on mechanical properties of SnAgCu/Cu joint using laser soldering. In: The Advances in Joining Technology. Lecture Notes in Mechanical Engineering . Springer, Singapore, pp. 97-107. ISBN 9978-981-10-9040-0 https://doi.org/10.1007/978-981-10-9041-7_8 https://doi.org/10.1007/978-981-10-9041-7_8
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Nabila, Tamar Jaya
Siti Rabiatull Aisha, Idris
M., Ishak
A review on mechanical properties of SnAgCu/Cu joint using laser soldering
description This paper focuses on publishing the review of mechanical properties at the interface between SnAgCu (SAC) solder and Copper substrate after laser soldering. This involved on basic principles of solder alloy and Copper diffusion mechanism. In addition, this paper also reviews laser solder effects towards mechanical properties of the solder joint. This paper approach on the review of the solder joint strength which regards to intermetallic compound type and thickness. The output of this paper is to create an understanding for the readers about variance of laser soldering parameters and its effect on the mechanical properties of the solder joint by including discussion from other research paper findings.
format Book Section
author Nabila, Tamar Jaya
Siti Rabiatull Aisha, Idris
M., Ishak
author_facet Nabila, Tamar Jaya
Siti Rabiatull Aisha, Idris
M., Ishak
author_sort Nabila, Tamar Jaya
title A review on mechanical properties of SnAgCu/Cu joint using laser soldering
title_short A review on mechanical properties of SnAgCu/Cu joint using laser soldering
title_full A review on mechanical properties of SnAgCu/Cu joint using laser soldering
title_fullStr A review on mechanical properties of SnAgCu/Cu joint using laser soldering
title_full_unstemmed A review on mechanical properties of SnAgCu/Cu joint using laser soldering
title_sort review on mechanical properties of snagcu/cu joint using laser soldering
publisher Springer, Singapore
publishDate 2018
url http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/
http://umpir.ump.edu.my/id/eprint/24641/1/2.%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf
http://umpir.ump.edu.my/id/eprint/24641/2/2.1%20A%20review%20on%20mechanical%20properties%20of%20SnAgCuCu%20joint%20using%20laser%20soldering.pdf
first_indexed 2023-09-18T22:37:24Z
last_indexed 2023-09-18T22:37:24Z
_version_ 1777416688006856704

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