Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method

Microwave hybrid heating (MHH) has been recognized for soldering process especially with lead-free solder alloy. This study seeks to investigates the effect of different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using MHH method. The susceptor material that wa...

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Main Authors:	Maliessa Nabilah, Mazelan, Siti Rabiatull Aisha, Idris
Format:	Conference or Workshop Item
Language:	English
Published:	IOP Publishing 2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/24327/ http://umpir.ump.edu.my/id/eprint/24327/ http://umpir.ump.edu.my/id/eprint/24327/1/50.1%20Effect%20of%20different%20amount%20of%20silicon%20carbide.pdf

id	ump-24327
recordtype	eprints
spelling	ump-243272019-09-17T01:27:43Z http://umpir.ump.edu.my/id/eprint/24327/ Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method Maliessa Nabilah, Mazelan Siti Rabiatull Aisha, Idris TJ Mechanical engineering and machinery Microwave hybrid heating (MHH) has been recognized for soldering process especially with lead-free solder alloy. This study seeks to investigates the effect of different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using MHH method. The susceptor material that was used to facilitate microwave heating in this study was Silicone Carbide (SiC). Different amount of SiC were used to compare its effect on the intermetallic compound (IMC) formed and shear strength at the solder joint. Domestic microwave with operating frequency 2.45GHz and 800W was used to join the solder and Cu substrate for 5, 6 and 7 minutes. Characterization of the samples were carried out using optical microscope, image analyzer and lap shear test. Microstructural study showed that scallop type structure of Cu6Sn5 was found at the SAC305/Cu interface after soldering with MHH technique. Thinnest Cu6Sn5 IMC (14.909μm) were obtained by soldering with 6g of SiC for 6 minutes while highest shear strength were observed when 4g of SiC were used for soldering for 7 minutes (26.71 MPa). IOP Publishing 2019-01 Conference or Workshop Item PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/24327/1/50.1%20Effect%20of%20different%20amount%20of%20silicon%20carbide.pdf Maliessa Nabilah, Mazelan and Siti Rabiatull Aisha, Idris (2019) Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method. In: 1st International Postgraduate Conference on Mechanical Engineering, IPCME 2018, 31 Oktober 2018 , Universiti Malaysia Pahang, Pekan. pp. 1-9., 469 (1). ISSN 1757-8981 (Submitted) https://doi.org/10.1088/1757-899X/469/1/012110
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Maliessa Nabilah, Mazelan Siti Rabiatull Aisha, Idris Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
description	Microwave hybrid heating (MHH) has been recognized for soldering process especially with lead-free solder alloy. This study seeks to investigates the effect of different amount of susceptor on the Sn-3.0Ag-0.5Cu-Copper (SAC305-Cu) joint performance by using MHH method. The susceptor material that was used to facilitate microwave heating in this study was Silicone Carbide (SiC). Different amount of SiC were used to compare its effect on the intermetallic compound (IMC) formed and shear strength at the solder joint. Domestic microwave with operating frequency 2.45GHz and 800W was used to join the solder and Cu substrate for 5, 6 and 7 minutes. Characterization of the samples were carried out using optical microscope, image analyzer and lap shear test. Microstructural study showed that scallop type structure of Cu6Sn5 was found at the SAC305/Cu interface after soldering with MHH technique. Thinnest Cu6Sn5 IMC (14.909μm) were obtained by soldering with 6g of SiC for 6 minutes while highest shear strength were observed when 4g of SiC were used for soldering for 7 minutes (26.71 MPa).
format	Conference or Workshop Item
author	Maliessa Nabilah, Mazelan Siti Rabiatull Aisha, Idris
author_facet	Maliessa Nabilah, Mazelan Siti Rabiatull Aisha, Idris
author_sort	Maliessa Nabilah, Mazelan
title	Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
title_short	Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
title_full	Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
title_fullStr	Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
title_full_unstemmed	Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
title_sort	effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method
publisher	IOP Publishing
publishDate	2019
url	http://umpir.ump.edu.my/id/eprint/24327/ http://umpir.ump.edu.my/id/eprint/24327/ http://umpir.ump.edu.my/id/eprint/24327/1/50.1%20Effect%20of%20different%20amount%20of%20silicon%20carbide.pdf
first_indexed	2023-09-18T22:36:44Z
last_indexed	2023-09-18T22:36:44Z
_version_	1777416646017679360

Effect of different amount of silicon carbide on sac solder-cu joint performance by using microwave hybrid heating method

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