Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.
Soldering is used extensively in the electronic industry. It used to connect printed circuit board to join the circuit between electronic parts. The quality and reliability of electronic products strongly depend on those of solder joints. The quality reliability of solder joint as the title of th...
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| Format: | Undergraduates Project Papers |
| Language: | English |
| Published: |
2007
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/2258/ http://umpir.ump.edu.my/id/eprint/2258/1/ARIFF_SYAKIRIN_BIN_GHAZALLI.PDF |
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ump-2258 |
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| recordtype |
eprints |
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ump-22582015-03-03T07:55:35Z http://umpir.ump.edu.my/id/eprint/2258/ Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. Ariff Syakirin, Ghazalli TK Electrical engineering. Electronics Nuclear engineering Soldering is used extensively in the electronic industry. It used to connect printed circuit board to join the circuit between electronic parts. The quality and reliability of electronic products strongly depend on those of solder joints. The quality reliability of solder joint as the title of this project is to study about joint solder of lead free solder (SnO.7Cu) and printed circuit board with various heat treatments. The objectives of this project is to analyze the strength between solder and printed circuit board by various heat treatment temperature besides investigate whether the change of temperature treatment will affect the joint strength of solder and printed circuit board. Tensile test is used in this project to analyze the reliability of the solder joint. At the end of the project, the reliable and efficient temperature is determined, 120°C at 1 hour heat treatment while unreliable temperature is 120°C at 2 hours of heat treatment. 2007-11 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/2258/1/ARIFF_SYAKIRIN_BIN_GHAZALLI.PDF Ariff Syakirin, Ghazalli (2007) Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. Faculty of Mechanical Engineering, Universiti Malaysia Pahang. |
| repository_type |
Digital Repository |
| institution_category |
Local University |
| institution |
Universiti Malaysia Pahang |
| building |
UMP Institutional Repository |
| collection |
Online Access |
| language |
English |
| topic |
TK Electrical engineering. Electronics Nuclear engineering |
| spellingShingle |
TK Electrical engineering. Electronics Nuclear engineering Ariff Syakirin, Ghazalli Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| description |
Soldering is used extensively in the electronic industry. It used to connect
printed circuit board to join the circuit between electronic parts. The quality and
reliability of electronic products strongly depend on those of solder joints. The
quality reliability of solder joint as the title of this project is to study about joint
solder of lead free solder (SnO.7Cu) and printed circuit board with various heat
treatments. The objectives of this project is to analyze the strength between solder
and printed circuit board by various heat treatment temperature besides investigate
whether the change of temperature treatment will affect the joint strength of solder
and printed circuit board. Tensile test is used in this project to analyze the reliability
of the solder joint. At the end of the project, the reliable and efficient temperature is
determined, 120°C at 1 hour heat treatment while unreliable temperature is 120°C at
2 hours of heat treatment. |
| format |
Undergraduates Project Papers |
| author |
Ariff Syakirin, Ghazalli |
| author_facet |
Ariff Syakirin, Ghazalli |
| author_sort |
Ariff Syakirin, Ghazalli |
| title |
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| title_short |
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| title_full |
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| title_fullStr |
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| title_full_unstemmed |
Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. |
| title_sort |
joint solder of lead free solder (sn0.7cu) and prrinted circuit board with various heat treatment temperatures. |
| publishDate |
2007 |
| url |
http://umpir.ump.edu.my/id/eprint/2258/ http://umpir.ump.edu.my/id/eprint/2258/1/ARIFF_SYAKIRIN_BIN_GHAZALLI.PDF |
| first_indexed |
2023-09-18T21:55:54Z |
| last_indexed |
2023-09-18T21:55:54Z |
| _version_ |
1777414076548251648 |