Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity...

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Main Authors:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/1/Deposition%20of%20Electroless%20Nickel%20Boron%20as%20Printed%20Circuit%20Board%20Surface%20Finish-fkm-2016-1.pdf

id	ump-15950
recordtype	eprints
spelling	ump-159502018-03-12T01:49:45Z http://umpir.ump.edu.my/id/eprint/15950/ Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity in coating thickness. However, in semiconductor sector, the usage of Nickel Boron as coating layer still insufficient due to lack of study in term of its potential as coating on printed circuit board. This study aims to investigate the mechanical and physical properties of electroless Nickel Boron as potential printed circuit board coating layer. The study conducted by cutting Copper substrates to 50mm x 7mm x 1.5mm and then subjected to surface pre-treatment before soak in Nickel Boron plating bath solution that contain of different concentration of Sodium Borohydrate (NaBH4), 0.4, 0.6,0.8,1.0 and 1.2 g/l. Surface roughness was evaluated using 3D Roughness Reconstruction software. For mechanical properties, the hardness test was conducted by using Vickers Hardness Test MMT-X7 Matsuzawa and surface structure was evaluate using ProgRes C3 IM7200 Optical Microscope and Field Emission Scanning Electron Microscopy (FESEM). It was found that the surface roughness and hardness resistance were affected by Sodium Borohydrate (NaBH4) that correlate with the surface microstructure Trans Tech Publications, Switzerland 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/15950/1/Deposition%20of%20Electroless%20Nickel%20Boron%20as%20Printed%20Circuit%20Board%20Surface%20Finish-fkm-2016-1.pdf Hardinnawirda, Kahar and Zetty Akhtar, Abd Malek and Siti Rabiatull Aisha, Idris and M., Ishak (2016) Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish. Advanced Materials Research, 1133. pp. 391-395. ISSN 1022-6680 (print), 1662-8985 (online) http://www.scientific.net/AMR.1133.391 doi: 10.4028/www.scientific.net/AMR.1133.391
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
description	Electroless Nickel Boron had been appointed as potential coating in several applications in industry like aeronatics, petrochemical industry, electronics and firearms due to its desirable physical and mechanical properties such as high wear resistance and high hardness including provides uniformity in coating thickness. However, in semiconductor sector, the usage of Nickel Boron as coating layer still insufficient due to lack of study in term of its potential as coating on printed circuit board. This study aims to investigate the mechanical and physical properties of electroless Nickel Boron as potential printed circuit board coating layer. The study conducted by cutting Copper substrates to 50mm x 7mm x 1.5mm and then subjected to surface pre-treatment before soak in Nickel Boron plating bath solution that contain of different concentration of Sodium Borohydrate (NaBH4), 0.4, 0.6,0.8,1.0 and 1.2 g/l. Surface roughness was evaluated using 3D Roughness Reconstruction software. For mechanical properties, the hardness test was conducted by using Vickers Hardness Test MMT-X7 Matsuzawa and surface structure was evaluate using ProgRes C3 IM7200 Optical Microscope and Field Emission Scanning Electron Microscopy (FESEM). It was found that the surface roughness and hardness resistance were affected by Sodium Borohydrate (NaBH4) that correlate with the surface microstructure
format	Article
author	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_facet	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_sort	Hardinnawirda, Kahar
title	Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
title_short	Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
title_full	Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
title_fullStr	Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
title_full_unstemmed	Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
title_sort	deposition of electroless nickel boron as printed circuit board surface finish
publisher	Trans Tech Publications, Switzerland
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/ http://umpir.ump.edu.my/id/eprint/15950/1/Deposition%20of%20Electroless%20Nickel%20Boron%20as%20Printed%20Circuit%20Board%20Surface%20Finish-fkm-2016-1.pdf
first_indexed	2023-09-18T22:21:12Z
last_indexed	2023-09-18T22:21:12Z
_version_	1777415668179664896

Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish

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