The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface f...

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Main Authors:	Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Saliza Azlina, Osman
Format:	Article
Language:	English
Published:	World Academy of Science, Engineering and Technology 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf

id	ump-15813
recordtype	eprints
spelling	ump-158132018-01-15T07:34:29Z http://umpir.ump.edu.my/id/eprint/15813/ The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman TJ Mechanical engineering and machinery The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined. World Academy of Science, Engineering and Technology 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf Siti Rabiatull Aisha, Idris and Ourdjini, Ali and Saliza Azlina, Osman (2016) The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation. International Journal of Chemical, Molecular, Nuclear, Materials and Metallurgical Engineering, 10 (1). pp. 107-111. ISSN 1307-6892 http://waset.org/Publication/the-effectiveness-of-bismuth-addition-to-retard-the-intermetallic-compound-formation/10004675
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
description	The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.
format	Article
author	Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman
author_facet	Siti Rabiatull Aisha, Idris Ourdjini, Ali Saliza Azlina, Osman
author_sort	Siti Rabiatull Aisha, Idris
title	The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
title_short	The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
title_full	The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
title_fullStr	The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
title_full_unstemmed	The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation
title_sort	effectiveness of bismuth addition to retard the intermetallic compound formation
publisher	World Academy of Science, Engineering and Technology
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/ http://umpir.ump.edu.my/id/eprint/15813/1/The-Effectiveness-of-Bismuth.pdf
first_indexed	2023-09-18T22:20:53Z
last_indexed	2023-09-18T22:20:53Z
_version_	1777415648908935168

The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

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