Experimental laser-machining of silicon wafer
This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis d...
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| Format: | Undergraduates Project Papers |
| Language: | English |
| Published: |
2010
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| Online Access: | http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/1/Lau%2C_Zhen_Chyen_%28_CD_5022_%29.pdf |