A Review: Lead Free Solder and Its Wettability Properties
The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder char...
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| Format: | Article |
| Language: | English |
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Emerald Group Publishing Limited
2016
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| Online Access: | http://umpir.ump.edu.my/id/eprint/13901/ http://umpir.ump.edu.my/id/eprint/13901/ http://umpir.ump.edu.my/id/eprint/13901/1/fkm-2016-aisha-Review%20lead%20free.pdf |
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ump-13901 |
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eprints |
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ump-139012018-01-11T08:20:11Z http://umpir.ump.edu.my/id/eprint/13901/ A Review: Lead Free Solder and Its Wettability Properties Ervina Efzan, Ervina Efzan Nur Faziera, Mhd Nasir Siti Rabiatull Aisha, Idris Not Available The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder.This paper also reviews on the lead free solder characteristics that focused on its wettability. This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings. Emerald Group Publishing Limited 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/13901/1/fkm-2016-aisha-Review%20lead%20free.pdf Ervina Efzan, Ervina Efzan and Nur Faziera, Mhd Nasir and Siti Rabiatull Aisha, Idris (2016) A Review: Lead Free Solder and Its Wettability Properties. Soldering & Surface Mount Technology, 28 (3). pp. 125-132. ISSN 0954-0911 http://dx.doi.org/10.1108/SSMT-08-2015-0022 |
| repository_type |
Digital Repository |
| institution_category |
Local University |
| institution |
Universiti Malaysia Pahang |
| building |
UMP Institutional Repository |
| collection |
Online Access |
| language |
English |
| topic |
Not Available |
| spellingShingle |
Not Available Ervina Efzan, Ervina Efzan Nur Faziera, Mhd Nasir Siti Rabiatull Aisha, Idris A Review: Lead Free Solder and Its Wettability Properties |
| description |
The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder.This paper also reviews on the lead free solder characteristics that focused on its wettability. This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings. |
| format |
Article |
| author |
Ervina Efzan, Ervina Efzan Nur Faziera, Mhd Nasir Siti Rabiatull Aisha, Idris |
| author_facet |
Ervina Efzan, Ervina Efzan Nur Faziera, Mhd Nasir Siti Rabiatull Aisha, Idris |
| author_sort |
Ervina Efzan, Ervina Efzan |
| title |
A Review: Lead Free Solder and Its Wettability Properties |
| title_short |
A Review: Lead Free Solder and Its Wettability Properties |
| title_full |
A Review: Lead Free Solder and Its Wettability Properties |
| title_fullStr |
A Review: Lead Free Solder and Its Wettability Properties |
| title_full_unstemmed |
A Review: Lead Free Solder and Its Wettability Properties |
| title_sort |
review: lead free solder and its wettability properties |
| publisher |
Emerald Group Publishing Limited |
| publishDate |
2016 |
| url |
http://umpir.ump.edu.my/id/eprint/13901/ http://umpir.ump.edu.my/id/eprint/13901/ http://umpir.ump.edu.my/id/eprint/13901/1/fkm-2016-aisha-Review%20lead%20free.pdf |
| first_indexed |
2023-09-18T22:17:02Z |
| last_indexed |
2023-09-18T22:17:02Z |
| _version_ |
1777415405853212672 |