Warpage optimization of a name card holder using neural network model

Injection molding has become widely process that used in plastic manufacturing. To produce high quality product, it has to consider the process condition. In this study, optimum parameters for injection molding of a name card holder are determined. Finite element software MoldFlow, statistical desi...

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Bibliographic Details
Main Author: Ahmad Amiruddin, Rosdi
Format: Undergraduates Project Papers
Language:English
English
English
English
Published: 2009
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/1172/
http://umpir.ump.edu.my/id/eprint/1172/
http://umpir.ump.edu.my/id/eprint/1172/7/Warpage%20optimization%20of%20a%20name%20card%20holder%20using%20neural%20network%20model%20-%20table%20of%20content.pdf
http://umpir.ump.edu.my/id/eprint/1172/4/Warpage%20optimization%20of%20a%20name%20card%20holder%20using%20neural%20network%20model%20-%20abstract.pdf
http://umpir.ump.edu.my/id/eprint/1172/5/Warpage%20optimization%20of%20a%20name%20card%20holder%20using%20neural%20network%20model%20-%20chapter%201.pdf
http://umpir.ump.edu.my/id/eprint/1172/6/Warpage%20optimization%20of%20a%20name%20card%20holder%20using%20neural%20network%20model%20-%20references.pdf
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Summary:Injection molding has become widely process that used in plastic manufacturing. To produce high quality product, it has to consider the process condition. In this study, optimum parameters for injection molding of a name card holder are determined. Finite element software MoldFlow, statistical design of experiment and artificial neural network are used in finding optimum value. The process parameter influencing warpage is determined using finite element software based on data using full factorial design. By exploiting finite element analysis result, a predictive model using artificial neural network is created. Optimum value is determined by comparing result by using finite element analysis and optimization using artificial neural network and choose the smallest percentage of error.