Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials

The cutting mechanism and residual stress profile of the micro-cutting thin workpiece are affected by the interaction of the thin workpiece and the fixture (substrate) underneath it similar to that observed in the nano-indentation and nano-scratching of thin film. The appropriate substrate propertie...

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Main Authors:	Saptaji, Kushendarsyah, Subbiah, Sathyan
Format:	Conference or Workshop Item
Language:	English English
Published:	IOP Publishing 2016
Subjects:	TJ Mechanical engineering and machinery TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/11329/ http://umpir.ump.edu.my/id/eprint/11329/ http://umpir.ump.edu.my/id/eprint/11329/1/iMEC_2015__APCOMS_2015_submission_18.pdf http://umpir.ump.edu.my/id/eprint/11329/7/fkp-saptaji-2016-Finite%20Element%20Study%20of%20the%20Effect%20of%20Substrate%20Properties.pdf

id	ump-11329
recordtype	eprints
spelling	ump-113292018-02-23T07:18:30Z http://umpir.ump.edu.my/id/eprint/11329/ Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials Saptaji, Kushendarsyah Subbiah, Sathyan TJ Mechanical engineering and machinery TS Manufactures The cutting mechanism and residual stress profile of the micro-cutting thin workpiece are affected by the interaction of the thin workpiece and the fixture (substrate) underneath it similar to that observed in the nano-indentation and nano-scratching of thin film. The appropriate substrate properties are necessary especially to avoid detachment during machining and to minimize deformation and warping of the machined thin workpiece. Thus, the investigations of the influence of substrate properties on micro-cutting thin workpiece are essentially to be conducted. The finite element study of orthogonal micro-cutting of thin Al6061-T6 is presented here. The simulations were conducted to study the residual stress profile across the thickness of the machined thin workpiece at various workpiece thicknesses and various substrate (adhesive) elastic properties. Simulations results show that as the machined workpiece become thinner, the stress is more significant not only on the machined surface but also it can reach the bottom of the workpiece. The stiffer substrate produces less variation of the stress across the workpiece thickness while more compliant substrate produces broader stress variation as the workpiece become thinner. The results show the significant effect of the workpiece thickness and the substrate properties on the stress profiles in the micro-cutting of thin workpiece. IOP Publishing 2016 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11329/1/iMEC_2015__APCOMS_2015_submission_18.pdf application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/11329/7/fkp-saptaji-2016-Finite%20Element%20Study%20of%20the%20Effect%20of%20Substrate%20Properties.pdf Saptaji, Kushendarsyah and Subbiah, Sathyan (2016) Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials. In: IOP Conference Series: Materials Science and Engineering: 2nd International Manufacturing Engineering Conference and 3rd Asia-Pacific Conference on Manufacturing Systems (iMEC-APCOMS 2015), 12–14 November 2015 , Kuala Lumpur, Malaysia. pp. 1-11., 114 (012005). http://dx.doi.org/10.1088/1757-899X/114/1/012005
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	TJ Mechanical engineering and machinery TS Manufactures
spellingShingle	TJ Mechanical engineering and machinery TS Manufactures Saptaji, Kushendarsyah Subbiah, Sathyan Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
description	The cutting mechanism and residual stress profile of the micro-cutting thin workpiece are affected by the interaction of the thin workpiece and the fixture (substrate) underneath it similar to that observed in the nano-indentation and nano-scratching of thin film. The appropriate substrate properties are necessary especially to avoid detachment during machining and to minimize deformation and warping of the machined thin workpiece. Thus, the investigations of the influence of substrate properties on micro-cutting thin workpiece are essentially to be conducted. The finite element study of orthogonal micro-cutting of thin Al6061-T6 is presented here. The simulations were conducted to study the residual stress profile across the thickness of the machined thin workpiece at various workpiece thicknesses and various substrate (adhesive) elastic properties. Simulations results show that as the machined workpiece become thinner, the stress is more significant not only on the machined surface but also it can reach the bottom of the workpiece. The stiffer substrate produces less variation of the stress across the workpiece thickness while more compliant substrate produces broader stress variation as the workpiece become thinner. The results show the significant effect of the workpiece thickness and the substrate properties on the stress profiles in the micro-cutting of thin workpiece.
format	Conference or Workshop Item
author	Saptaji, Kushendarsyah Subbiah, Sathyan
author_facet	Saptaji, Kushendarsyah Subbiah, Sathyan
author_sort	Saptaji, Kushendarsyah
title	Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
title_short	Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
title_full	Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
title_fullStr	Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
title_full_unstemmed	Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials
title_sort	finite element study on the effect of substrate properties in micro-cutting thin workpiece materials
publisher	IOP Publishing
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/11329/ http://umpir.ump.edu.my/id/eprint/11329/ http://umpir.ump.edu.my/id/eprint/11329/1/iMEC_2015__APCOMS_2015_submission_18.pdf http://umpir.ump.edu.my/id/eprint/11329/7/fkp-saptaji-2016-Finite%20Element%20Study%20of%20the%20Effect%20of%20Substrate%20Properties.pdf
first_indexed	2023-09-18T22:11:57Z
last_indexed	2023-09-18T22:11:57Z
_version_	1777415086301773824

Finite Element Study on The Effect of Substrate Properties in Micro-cutting Thin Workpiece Materials

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