A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability

The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for evaluation of the solder joint reliability wi...

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Main Authors:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris
Format:	Book Section
Language:	English English
Published:	WIT Press 2017
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/10492/ http://umpir.ump.edu.my/id/eprint/10492/ http://umpir.ump.edu.my/id/eprint/10492/1/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf http://umpir.ump.edu.my/id/eprint/10492/7/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf

id	ump-10492
recordtype	eprints
spelling	ump-104922018-01-15T04:27:31Z http://umpir.ump.edu.my/id/eprint/10492/ A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris TJ Mechanical engineering and machinery The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic device's technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using Nickel-based surface finish was summarizes. Study was focusing on Nickel based surface finish (ENIG and ENEPIG) with different cooling medium, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. Faster cooling rate was reported to provide finer IMC grains which might be translated into a better solder joint strength. The findings presented here may provide a better understanding for a further study and facilitate improvements in term of solder joint reliability. WIT Press 2017 Book Section PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/10492/1/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/10492/7/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf Hardinnawirda, Kahar and Zetty Akhtar, Abd Malek and Siti Rabiatull Aisha, Idris (2017) A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability. In: High Performance and Optimum Design of Structures and Materials II. WIT Transactions on The Built Environmen. WIT Press, pp. 1-3. ISBN 9781784661434 https://books.google.com.my/books?id=gqOVDQAAQBAJ&pg=PA201&dq=A+Review+on+Effect+of+Surface+Finish+and+Cooling+Rate+on+Solder+Joint+Reliability&hl=en&sa=X&redir_esc=y#v=onepage&q=A%20Review%20on%20Effect%20of%20Surface%20Finish%20and%20Cooling%20Rate%20on
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
description	The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for evaluation of the solder joint reliability with respect to solder alloys and surface finishes. However, as the demand of electronic devices is increasing, there is a need to improve the mechanical properties of the solder joint in order to keep up with the current evolution of electronic device's technology. In this study, the effect of surface finish and cooling rate on solder joint reliability using Nickel-based surface finish was summarizes. Study was focusing on Nickel based surface finish (ENIG and ENEPIG) with different cooling medium, slow (furnace), medium (air) and fast (water). It was found that the type of surface finish and the cooling rate can change the morphology of the solder intermetallic compound (IMC) and directly changes the solder joint mechanical properties. Faster cooling rate was reported to provide finer IMC grains which might be translated into a better solder joint strength. The findings presented here may provide a better understanding for a further study and facilitate improvements in term of solder joint reliability.
format	Book Section
author	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris
author_facet	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris
author_sort	Hardinnawirda, Kahar
title	A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
title_short	A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
title_full	A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
title_fullStr	A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
title_full_unstemmed	A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability
title_sort	review on effect of surface finish and cooling rate on solder joint reliability
publisher	WIT Press
publishDate	2017
url	http://umpir.ump.edu.my/id/eprint/10492/ http://umpir.ump.edu.my/id/eprint/10492/ http://umpir.ump.edu.my/id/eprint/10492/1/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf http://umpir.ump.edu.my/id/eprint/10492/7/24.%20A%20review%20on%20the%20effect%20of%20surface%20finish%20and%20cooling%20rate%20on%20solder%20joint%20reliability.pdf
first_indexed	2023-09-18T22:10:09Z
last_indexed	2023-09-18T22:10:09Z
_version_	1777414973364895744

A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability

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