Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan

This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials,...

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Main Authors:	Mohamed, Mazlan, Atan, Rahim
Format:	Article
Language:	English
Published:	Research Management Institute (RMI) 2011
Subjects:	Numerical simulation. Monte Carlo method Thermal conductivity
Online Access:	http://ir.uitm.edu.my/id/eprint/12941/ http://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf

id	uitm-12941
recordtype	eprints
spelling	uitm-129412016-05-30T02:19:31Z http://ir.uitm.edu.my/id/eprint/12941/ Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan Mohamed, Mazlan Atan, Rahim Numerical simulation. Monte Carlo method Thermal conductivity This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package The comparison between three types of material in terms of junction temperature has been observed and it was found that the junction temperature of the nano-silver had the lowest junction temperature as compared to epoxy and composite polymer. It also found that the nanosilver had the highest value of thermal conductivity as compared to the others. The strength of CFD software in handling heat transfer problems is proved to be excellent. Research Management Institute (RMI) 2011 Article PeerReviewed text en http://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf Mohamed, Mazlan and Atan, Rahim (2011) Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan. Scientific Research Journal, 8 (1). pp. 29-39. ISSN 1675-7009
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Teknologi MARA
building	UiTM Institutional Repository
collection	Online Access
language	English
topic	Numerical simulation. Monte Carlo method Thermal conductivity
spellingShingle	Numerical simulation. Monte Carlo method Thermal conductivity Mohamed, Mazlan Atan, Rahim Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
description	This paper presents the simulation of three dimensional numerical analyses of heat and fluid flow through chip package. 3D model of chip packages is built using GAMBIT and simulated using FLUENT software. The study was made for four chip packages arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package The comparison between three types of material in terms of junction temperature has been observed and it was found that the junction temperature of the nano-silver had the lowest junction temperature as compared to epoxy and composite polymer. It also found that the nanosilver had the highest value of thermal conductivity as compared to the others. The strength of CFD software in handling heat transfer problems is proved to be excellent.
format	Article
author	Mohamed, Mazlan Atan, Rahim
author_facet	Mohamed, Mazlan Atan, Rahim
author_sort	Mohamed, Mazlan
title	Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
title_short	Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
title_full	Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
title_fullStr	Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
title_full_unstemmed	Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan
title_sort	three dimensional cfd simulations of junction temperature of electronic components using nano-silver / mazlan mohamed and rahim atan
publisher	Research Management Institute (RMI)
publishDate	2011
url	http://ir.uitm.edu.my/id/eprint/12941/ http://ir.uitm.edu.my/id/eprint/12941/1/AJ_MAZLAN%20MOHAMED%20SRJ%2011%201.pdf
first_indexed	2023-09-18T22:49:36Z
last_indexed	2023-09-18T22:49:36Z
_version_	1777417454728773632

Three dimensional CFD simulations of junction temperature of electronic components using nano-silver / Mazlan Mohamed and Rahim Atan

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