Simulation and fabrication of micro magnetometer using flip-chip bonding technique

Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The pr...

Full description

Bibliographic Details
Main Authors:	Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
Other Authors:	Alfred, Rayner
Format:	Conference or Workshop Item
Language:	English English
Published:	Springer Nature Singapore Pte Ltd. 2019
Subjects:	T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Online Access:	http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/1/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer.pdf http://irep.iium.edu.my/73199/7/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer%20using%20flip-chip%20bonding%20technique_scopus.pdf

id	iium-73199
recordtype	eprints
spelling	iium-731992019-10-16T09:24:00Z http://irep.iium.edu.my/73199/ Simulation and fabrication of micro magnetometer using flip-chip bonding technique Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The presence of magnetic fields’ strength and direction can be detected by a device known as magnetometer. A magnetometer that is durable, room temperature operation and having non-movable components is chooses for this project. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed. Springer Nature Singapore Pte Ltd. Alfred, Rayner Ag Ibrahim, Ag Asri Lim, Yuto Anthony, Patricia 2019 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/73199/1/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer.pdf application/pdf en http://irep.iium.edu.my/73199/7/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer%20using%20flip-chip%20bonding%20technique_scopus.pdf Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2019) Simulation and fabrication of micro magnetometer using flip-chip bonding technique. In: 5th International Conference on Computational Science and Technology, ICCST 2018, 29-30 Aug 2018, Kota Kinabalu. https://link.springer.com/chapter/10.1007/978-981-13-2622-6_48 https://doi.org/10.1007/978-981-13-2622-6
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English
topic	T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
spellingShingle	T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril Simulation and fabrication of micro magnetometer using flip-chip bonding technique
description	Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The presence of magnetic fields’ strength and direction can be detected by a device known as magnetometer. A magnetometer that is durable, room temperature operation and having non-movable components is chooses for this project. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed.
author2	Alfred, Rayner
author_facet	Alfred, Rayner Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril
format	Conference or Workshop Item
author	Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril
author_sort	Tengku Azmi, Tengku Muhammad Afif
title	Simulation and fabrication of micro magnetometer using flip-chip bonding technique
title_short	Simulation and fabrication of micro magnetometer using flip-chip bonding technique
title_full	Simulation and fabrication of micro magnetometer using flip-chip bonding technique
title_fullStr	Simulation and fabrication of micro magnetometer using flip-chip bonding technique
title_full_unstemmed	Simulation and fabrication of micro magnetometer using flip-chip bonding technique
title_sort	simulation and fabrication of micro magnetometer using flip-chip bonding technique
publisher	Springer Nature Singapore Pte Ltd.
publishDate	2019
url	http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/ http://irep.iium.edu.my/73199/1/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer.pdf http://irep.iium.edu.my/73199/7/73199_Simulation%20and%20fabrication%20of%20micro%20magnetometer%20using%20flip-chip%20bonding%20technique_scopus.pdf
first_indexed	2023-09-18T21:43:47Z
last_indexed	2023-09-18T21:43:47Z
_version_	1777413314789244928

Simulation and fabrication of micro magnetometer using flip-chip bonding technique

Similar Items