Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining

This study investigates the use of nanopowder-mixed dielectric oil and temporary metallic coating on highly doped Si sample to achieve nanometric surface roughness using μ-WEDM operation. To achieve this, two different nanopowders were used in dielectric medium with two different temporary metallic...

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Main Authors:	Jarin, Sams, Saleh, Tanveer, Muthalif, Asan G. A., Ali, Mohammad Yeakub, Bhuiyan, Moinul
Format:	Article
Language:	English English English
Published:	Springer Verlag 2018
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/18/66411_Towards%20achieving%20nanofinish%20on%20silicon_complete.pdf http://irep.iium.edu.my/66411/7/66411_Towards%20achieving%20nanofinish%20on%20silicon%20SCOPUS.pdf http://irep.iium.edu.my/66411/12/66411%20Towards%20achieving%20nanofinish%20on%20silicon%20WOS.pdf

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spelling	iium-664112019-05-21T02:40:38Z http://irep.iium.edu.my/66411/ Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining Jarin, Sams Saleh, Tanveer Muthalif, Asan G. A. Ali, Mohammad Yeakub Bhuiyan, Moinul T Technology (General) This study investigates the use of nanopowder-mixed dielectric oil and temporary metallic coating on highly doped Si sample to achieve nanometric surface roughness using μ-WEDM operation. To achieve this, two different nanopowders were used in dielectric medium with two different temporary metallic coating in the workpiece. This is with Al and C with metallic coating of (gold) thickness 160 nm and 320 nm. Further, the discharge energy level was varied into two proximate stages (80 V/13 pF and 85 V/0.1 nF). The results show that nanopowder-assisted μ-WEDM process has improved the material removal rate (MRR) by ~ 44.5% (maximum). However, the spark gap (SG) has also been increased to a maximum of 60% than without nanopowder assisted the μ-WEDM process. Further, it was found in our study that graphite (C) nanopowder usually generates lower spark gap as compared to aluminum (Al) nanopowder. It has also been observed that at specific μ-WEDM condition, coating thickness, and powder concentration C, Al can easily produce nanometric average surface roughness (ASR) (for C lowest ASR was 76 nm and for Al lowest ASR was 83 nm). From the findings, it can be understood that ASR can be improved maximum ~ 65% for C nanopowder and ~ 51% for Al nanopowder-assisted μ-wire electro-discharge machining as compared to conventional μ-WEDM of Si wafer. Machining stability and evenness of the machined slots were also improved by a significant margin when nanopowder-assisted μ-wire electro-discharge machining method was applied. Springer Verlag 2018-12-01 Article PeerReviewed application/pdf en http://irep.iium.edu.my/66411/18/66411_Towards%20achieving%20nanofinish%20on%20silicon_complete.pdf application/pdf en http://irep.iium.edu.my/66411/7/66411_Towards%20achieving%20nanofinish%20on%20silicon%20SCOPUS.pdf application/pdf en http://irep.iium.edu.my/66411/12/66411%20Towards%20achieving%20nanofinish%20on%20silicon%20WOS.pdf Jarin, Sams and Saleh, Tanveer and Muthalif, Asan G. A. and Ali, Mohammad Yeakub and Bhuiyan, Moinul (2018) Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining. International Journal of Advanced Manufacturing Technology, 99 (9). pp. 3005-3015. ISSN 0268-3768 E-ISSN 1433-3015 https://www.springer.com/engineering/industrial+management/journal/170 10.1007/s00170-018-2692-4
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English English
topic	T Technology (General)
spellingShingle	T Technology (General) Jarin, Sams Saleh, Tanveer Muthalif, Asan G. A. Ali, Mohammad Yeakub Bhuiyan, Moinul Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
description	This study investigates the use of nanopowder-mixed dielectric oil and temporary metallic coating on highly doped Si sample to achieve nanometric surface roughness using μ-WEDM operation. To achieve this, two different nanopowders were used in dielectric medium with two different temporary metallic coating in the workpiece. This is with Al and C with metallic coating of (gold) thickness 160 nm and 320 nm. Further, the discharge energy level was varied into two proximate stages (80 V/13 pF and 85 V/0.1 nF). The results show that nanopowder-assisted μ-WEDM process has improved the material removal rate (MRR) by ~ 44.5% (maximum). However, the spark gap (SG) has also been increased to a maximum of 60% than without nanopowder assisted the μ-WEDM process. Further, it was found in our study that graphite (C) nanopowder usually generates lower spark gap as compared to aluminum (Al) nanopowder. It has also been observed that at specific μ-WEDM condition, coating thickness, and powder concentration C, Al can easily produce nanometric average surface roughness (ASR) (for C lowest ASR was 76 nm and for Al lowest ASR was 83 nm). From the findings, it can be understood that ASR can be improved maximum ~ 65% for C nanopowder and ~ 51% for Al nanopowder-assisted μ-wire electro-discharge machining as compared to conventional μ-WEDM of Si wafer. Machining stability and evenness of the machined slots were also improved by a significant margin when nanopowder-assisted μ-wire electro-discharge machining method was applied.
format	Article
author	Jarin, Sams Saleh, Tanveer Muthalif, Asan G. A. Ali, Mohammad Yeakub Bhuiyan, Moinul
author_facet	Jarin, Sams Saleh, Tanveer Muthalif, Asan G. A. Ali, Mohammad Yeakub Bhuiyan, Moinul
author_sort	Jarin, Sams
title	Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
title_short	Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
title_full	Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
title_fullStr	Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
title_full_unstemmed	Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining
title_sort	towards achieving nanofinish on silicon (si) wafer by μ-wire electro-discharge machining
publisher	Springer Verlag
publishDate	2018
url	http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/ http://irep.iium.edu.my/66411/18/66411_Towards%20achieving%20nanofinish%20on%20silicon_complete.pdf http://irep.iium.edu.my/66411/7/66411_Towards%20achieving%20nanofinish%20on%20silicon%20SCOPUS.pdf http://irep.iium.edu.my/66411/12/66411%20Towards%20achieving%20nanofinish%20on%20silicon%20WOS.pdf
first_indexed	2023-09-18T21:34:17Z
last_indexed	2023-09-18T21:34:17Z
_version_	1777412716139380736

Towards achieving nanofinish on silicon (Si) wafer by μ-wire electro-discharge machining

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