Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink

High energy requirement for electronic cooling is a major problem to operate high performance computers and data centres. Developing low cost thermal management systems for micro-electronic devices and micro-electro-mechanical systems (MEMS) is a cutting edge research area. A heat pump system associ...

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Main Authors:	Ahmed, Shugata, Sulaeman, Erwin, Ismail, Ahmad Faris, Muhammad, Hasibul Hasan
Format:	Article
Language:	English
Published:	Science Publishing Corporation 2018
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/1/65278_Two-phase%20Fin-induced%20Turbulent%20Cooling.pdf

id	iium-65278
recordtype	eprints
spelling	iium-652782018-08-21T04:48:33Z http://irep.iium.edu.my/65278/ Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink Ahmed, Shugata Sulaeman, Erwin Ismail, Ahmad Faris Muhammad, Hasibul Hasan TJ Mechanical engineering and machinery High energy requirement for electronic cooling is a major problem to operate high performance computers and data centres. Developing low cost thermal management systems for micro-electronic devices and micro-electro-mechanical systems (MEMS) is a cutting edge research area. A heat pump system associating micro-gap evaporator with internal micro-fins is a potential candidate for two-phase cooling of these advanced devices. Micro-fins induce pseudo-turbulence in the flow field, which escalates heat transfer rate. In this paper, the system per-formance of a heat pump using micro-gap evaporator has been investigated numerically and experimentally. As heat transfer rate in the mi-cro-gap evaporator is influenced by turbulence generation, flow field in the inlet and outlet manifolds have been visualized in the numerical simulation to observe fin-induced pseudo-turbulence at the entrance and outlet of the micro-gap evaporator. The simulation has been per-formed using FLUENT 14.5 release. Experimental work has been carried out to validate numerical results. For experimentation purpose, a test rig has been developed, which contains a test section accommodating the micro-gap evaporator. A heater is provided at the bottom of the evaporator to supply uniform heat flux ranging 1 ~ 8 kW/m2. A pre-heater is installed at the compressor outlet to vary refrigerant tempera-ture at the condenser inlet. The range of pre-heater temperature is 93 ~ 159°C. A variable speed compressor is used. The input frequency to the compressor is varied within the range of 20 ~ 50 Hz to run the compressor at different speeds. Experimental data show good agreement with numerical results. It is observed that in transient state, temperatures and pressures at different locations of the test apparatus fluctuate due to quasi-periodic dry out and surface rewetting nature of the flow. When pre-heater temperature is set at 159⁰C and compressor fre-quency is increased from 20 Hz to 30 Hz, evaporator wall heat flux escalates 118.2% and heat transfer rate of the condenser increases 65.2%. However, heat transfer rate declines with the further increment of compressor frequency. Coefficient of performance (COP) of the heat pump also increases with the frequency increment from 20 Hz to 30 Hz and declines after surpassing 40 Hz frequency. Science Publishing Corporation 2018-07 Article PeerReviewed application/pdf en http://irep.iium.edu.my/65278/1/65278_Two-phase%20Fin-induced%20Turbulent%20Cooling.pdf Ahmed, Shugata and Sulaeman, Erwin and Ismail, Ahmad Faris and Muhammad, Hasibul Hasan (2018) Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink. International Journal of Engineering & Technology, 7 (3.13). pp. 113-122. ISSN 2227-524X https://www.sciencepubco.com/index.php/ijet/article/view/16336 10.14419/ijet.v7i3.13.16336
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Ahmed, Shugata Sulaeman, Erwin Ismail, Ahmad Faris Muhammad, Hasibul Hasan Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
description	High energy requirement for electronic cooling is a major problem to operate high performance computers and data centres. Developing low cost thermal management systems for micro-electronic devices and micro-electro-mechanical systems (MEMS) is a cutting edge research area. A heat pump system associating micro-gap evaporator with internal micro-fins is a potential candidate for two-phase cooling of these advanced devices. Micro-fins induce pseudo-turbulence in the flow field, which escalates heat transfer rate. In this paper, the system per-formance of a heat pump using micro-gap evaporator has been investigated numerically and experimentally. As heat transfer rate in the mi-cro-gap evaporator is influenced by turbulence generation, flow field in the inlet and outlet manifolds have been visualized in the numerical simulation to observe fin-induced pseudo-turbulence at the entrance and outlet of the micro-gap evaporator. The simulation has been per-formed using FLUENT 14.5 release. Experimental work has been carried out to validate numerical results. For experimentation purpose, a test rig has been developed, which contains a test section accommodating the micro-gap evaporator. A heater is provided at the bottom of the evaporator to supply uniform heat flux ranging 1 ~ 8 kW/m2. A pre-heater is installed at the compressor outlet to vary refrigerant tempera-ture at the condenser inlet. The range of pre-heater temperature is 93 ~ 159°C. A variable speed compressor is used. The input frequency to the compressor is varied within the range of 20 ~ 50 Hz to run the compressor at different speeds. Experimental data show good agreement with numerical results. It is observed that in transient state, temperatures and pressures at different locations of the test apparatus fluctuate due to quasi-periodic dry out and surface rewetting nature of the flow. When pre-heater temperature is set at 159⁰C and compressor fre-quency is increased from 20 Hz to 30 Hz, evaporator wall heat flux escalates 118.2% and heat transfer rate of the condenser increases 65.2%. However, heat transfer rate declines with the further increment of compressor frequency. Coefficient of performance (COP) of the heat pump also increases with the frequency increment from 20 Hz to 30 Hz and declines after surpassing 40 Hz frequency.
format	Article
author	Ahmed, Shugata Sulaeman, Erwin Ismail, Ahmad Faris Muhammad, Hasibul Hasan
author_facet	Ahmed, Shugata Sulaeman, Erwin Ismail, Ahmad Faris Muhammad, Hasibul Hasan
author_sort	Ahmed, Shugata
title	Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
title_short	Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
title_full	Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
title_fullStr	Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
title_full_unstemmed	Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
title_sort	two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap heat sink
publisher	Science Publishing Corporation
publishDate	2018
url	http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/ http://irep.iium.edu.my/65278/1/65278_Two-phase%20Fin-induced%20Turbulent%20Cooling.pdf
first_indexed	2023-09-18T21:32:38Z
last_indexed	2023-09-18T21:32:38Z
_version_	1777412612974182400

Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink

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