Simulation and fabrication of micro magnetometer using flip-chip bonding technique
Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The pr...
Main Authors: | , |
---|---|
Format: | Conference or Workshop Item |
Language: | English English |
Published: |
2017
|
Subjects: | |
Online Access: | http://irep.iium.edu.my/64004/ http://irep.iium.edu.my/64004/1/ICCSE2017%20-%20Program%20Book.pdf http://irep.iium.edu.my/64004/7/64004%20Simulation%20and%20Fabrication%20of%20Micro.pdf |
id |
iium-64004 |
---|---|
recordtype |
eprints |
spelling |
iium-640042018-06-07T07:41:24Z http://irep.iium.edu.my/64004/ Simulation and fabrication of micro magnetometer using flip-chip bonding technique Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Magnetic field detection has been widely accepted in many applications such as military systems, outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection is particularly important in tracking of magnetic markers in digestive tracks or blood vessels. The presence of magnetic fields’ strength and direction can be detected by a device known as magnetometer. A magnetometer that is durable, room temperature operation and having non-movable components is chooses for this project. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed. Keywords: Magnetometer, microfabrication, miniaturization, micro-scale. 2017 Conference or Workshop Item NonPeerReviewed application/pdf en http://irep.iium.edu.my/64004/1/ICCSE2017%20-%20Program%20Book.pdf application/pdf en http://irep.iium.edu.my/64004/7/64004%20Simulation%20and%20Fabrication%20of%20Micro.pdf Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Simulation and fabrication of micro magnetometer using flip-chip bonding technique. In: The Second International Conference On Computational Science And Engineering 2017 (ICCSE 2017), 20-30 November 2017, Kuala Lumpur. (Unpublished) |
repository_type |
Digital Repository |
institution_category |
Local University |
institution |
International Islamic University Malaysia |
building |
IIUM Repository |
collection |
Online Access |
language |
English English |
topic |
TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices |
spellingShingle |
TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
description |
Magnetic field detection has been widely accepted in many applications such as military systems,
outer space exploration and even in medical diagnosis and treatment. Low magnetic field detection
is particularly important in tracking of magnetic markers in digestive tracks or blood
vessels. The presence of magnetic fields’ strength and direction can be detected by a device
known as magnetometer. A magnetometer that is durable, room temperature operation and
having non-movable components is chooses for this project. Traditional magnetometer tends to
be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the
magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually
fabricated using conventional microfabrication method particularly surface micromachining in
which micro structures are built level by level starting from the surface of substrates upwards
until completion of final structure. Although the miniaturization of magnetometer has been
widely researched and studied, the process however is not. Thus, the process governing the
fabrication technique is studied in this paper. Conventional method of fabrication is known
as surface micromachining. Besides time consuming, this method requires many consecutive
steps in fabrication process and careful alignment of patterns on every layer which increase the
complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication
process. The objective of this research includes designing micro scale magnetometer and
complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings
with 600μm thickness of wire and 300μm distance between each wire has been designed.
Keywords: Magnetometer, microfabrication, miniaturization, micro-scale. |
format |
Conference or Workshop Item |
author |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
author_facet |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
author_sort |
Tengku Azmi, Tengku Muhammad Afif |
title |
Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
title_short |
Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
title_full |
Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
title_fullStr |
Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
title_full_unstemmed |
Simulation and fabrication of micro magnetometer using flip-chip bonding technique |
title_sort |
simulation and fabrication of micro magnetometer using flip-chip bonding technique |
publishDate |
2017 |
url |
http://irep.iium.edu.my/64004/ http://irep.iium.edu.my/64004/1/ICCSE2017%20-%20Program%20Book.pdf http://irep.iium.edu.my/64004/7/64004%20Simulation%20and%20Fabrication%20of%20Micro.pdf |
first_indexed |
2023-09-18T21:30:46Z |
last_indexed |
2023-09-18T21:30:46Z |
_version_ |
1777412495213854720 |