Fabrication of micro magnetometer using flip-chip bonding

Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable a...

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Main Authors:	Tengku Azmi, Tengku Muhammad Afif, Sulaiman, Nadzril
Format:	Article
Language:	English
Published:	Institute of Technology and Research 2017
Subjects:	TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
Online Access:	http://irep.iium.edu.my/62817/ http://irep.iium.edu.my/62817/ http://irep.iium.edu.my/62817/1/IJMPE%20-%20Nadzril_Afif.pdf

id	iium-62817
recordtype	eprints
spelling	iium-628172018-03-20T01:03:51Z http://irep.iium.edu.my/62817/ Fabrication of micro magnetometer using flip-chip bonding Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable and robust magnetometer. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research include designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed. Institute of Technology and Research 2017-05 Article PeerReviewed application/pdf en http://irep.iium.edu.my/62817/1/IJMPE%20-%20Nadzril_Afif.pdf Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Fabrication of micro magnetometer using flip-chip bonding. International Journal of Mechanical And Production Engineering (IJMPE), 5 (5). pp. 30-33. ISSN 2320-2092 http://ijmpe.iraj.in/paper_detail.php?paper_id=8093&name=Fabrication_of_Micro_Magnetometer_Using_Flip-Chip_Bonding_Technique
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices
spellingShingle	TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril Fabrication of micro magnetometer using flip-chip bonding
description	Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable and robust magnetometer. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research include designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed.
format	Article
author	Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril
author_facet	Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril
author_sort	Tengku Azmi, Tengku Muhammad Afif
title	Fabrication of micro magnetometer using flip-chip bonding
title_short	Fabrication of micro magnetometer using flip-chip bonding
title_full	Fabrication of micro magnetometer using flip-chip bonding
title_fullStr	Fabrication of micro magnetometer using flip-chip bonding
title_full_unstemmed	Fabrication of micro magnetometer using flip-chip bonding
title_sort	fabrication of micro magnetometer using flip-chip bonding
publisher	Institute of Technology and Research
publishDate	2017
url	http://irep.iium.edu.my/62817/ http://irep.iium.edu.my/62817/ http://irep.iium.edu.my/62817/1/IJMPE%20-%20Nadzril_Afif.pdf
first_indexed	2023-09-18T21:29:00Z
last_indexed	2023-09-18T21:29:00Z
_version_	1777412384628932608

Fabrication of micro magnetometer using flip-chip bonding

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