Flip-chip bonding fabrication technique
Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment....
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IOP Publishing
2017
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| Online Access: | http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/1/ICOM%2717%20_%20IOP%20Published_%20Afif.pdf http://irep.iium.edu.my/59213/12/59213_Flip-Chip%20Bonding%20Fabrication%20Technique_scopus.pdf |
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iium-592132018-02-09T09:03:02Z http://irep.iium.edu.my/59213/ Flip-chip bonding fabrication technique Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Military systems, outer space exploration and even in medical diagnosis and treatment used magnetic field detection. Low magnetic field detection is particularly important in tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion into micro-scaled environment. This concern has brought the magnetometer into the trend of device miniaturization. Miniaturized magnetometer is usually fabricated using conventional microfabrication method particularly surface micromachining in which micro structures are built level by level starting from the surface of substrates upwards until completion of final structure. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research includes designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed. IOP Publishing 2017 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/59213/1/ICOM%2717%20_%20IOP%20Published_%20Afif.pdf application/pdf en http://irep.iium.edu.my/59213/12/59213_Flip-Chip%20Bonding%20Fabrication%20Technique_scopus.pdf Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Flip-chip bonding fabrication technique. In: 6th International Conference on Mechatronics 2017, 8-8 Aug 2017, Gombak. http://iopscience.iop.org/article/10.1088/1757-899X/260/1/012005 10.1088/1757-899X/260/1/012005 |
| repository_type |
Digital Repository |
| institution_category |
Local University |
| institution |
International Islamic University Malaysia |
| building |
IIUM Repository |
| collection |
Online Access |
| language |
English English |
| topic |
T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices |
| spellingShingle |
T Technology (General) TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril Flip-chip bonding fabrication technique |
| description |
Military systems, outer space exploration and even in medical diagnosis and treatment
used magnetic field detection. Low magnetic field detection is particularly important in
tracking of magnetic. Traditional magnetometer tends to be bulky that hinders its inclusion
into micro-scaled environment. This concern has brought the magnetometer into the trend
of device miniaturization. Miniaturized magnetometer is usually fabricated using
conventional microfabrication method particularly surface micromachining in which
micro structures are built level by level starting from the surface of substrates upwards
until completion of final structure. Although the miniaturization of magnetometer has been
widely researched and studied, the process however is not. Thus, the process governing the
fabrication technique is studied in this paper. Conventional method of fabrication is known
as surface micromachining. Besides time consuming, this method requires many
consecutive steps in fabrication process and careful alignment of patterns on every layer
which increase the complexity. Hence, studies are done to improve time consuming and
reliability of the microfabrication process. The objective of this research includes designing
micro scale magnetometer and complete device fabrication processes. A micro-scale search
coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance
between each wire has been designed. |
| format |
Conference or Workshop Item |
| author |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
| author_facet |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
| author_sort |
Tengku Azmi, Tengku Muhammad Afif |
| title |
Flip-chip bonding fabrication technique |
| title_short |
Flip-chip bonding fabrication technique |
| title_full |
Flip-chip bonding fabrication technique |
| title_fullStr |
Flip-chip bonding fabrication technique |
| title_full_unstemmed |
Flip-chip bonding fabrication technique |
| title_sort |
flip-chip bonding fabrication technique |
| publisher |
IOP Publishing |
| publishDate |
2017 |
| url |
http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/ http://irep.iium.edu.my/59213/1/ICOM%2717%20_%20IOP%20Published_%20Afif.pdf http://irep.iium.edu.my/59213/12/59213_Flip-Chip%20Bonding%20Fabrication%20Technique_scopus.pdf |
| first_indexed |
2023-09-18T21:23:51Z |
| last_indexed |
2023-09-18T21:23:51Z |
| _version_ |
1777412060261384192 |