Fabrication of micro magnetometer using flip-chip bonding technique
Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable an...
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2017
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| Online Access: | http://irep.iium.edu.my/56707/ http://irep.iium.edu.my/56707/ http://irep.iium.edu.my/56707/12/56707_fabrication%20%20of%20Micro%20Magnet%20Magnetometer_complete.pdf |
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iium-567072017-05-17T04:22:27Z http://irep.iium.edu.my/56707/ Fabrication of micro magnetometer using flip-chip bonding technique Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril TK Electrical engineering. Electronics Nuclear engineering TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable and robust magnetometer. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the microfabrication process. The objective of this research include designing micro scale magnetometer and complete device fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm distance between each wire has been designed. 2017-03-02 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/56707/12/56707_fabrication%20%20of%20Micro%20Magnet%20Magnetometer_complete.pdf Tengku Azmi, Tengku Muhammad Afif and Sulaiman, Nadzril (2017) Fabrication of micro magnetometer using flip-chip bonding technique. In: The IRES International Conference, 1-2 March 2017, Kuala Lumpur. http://www.worldresearchlibrary.org/proceeding.php?pid=702 |
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Digital Repository |
| institution_category |
Local University |
| institution |
International Islamic University Malaysia |
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IIUM Repository |
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Online Access |
| language |
English |
| topic |
TK Electrical engineering. Electronics Nuclear engineering TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices |
| spellingShingle |
TK Electrical engineering. Electronics Nuclear engineering TK7800 Electronics. Computer engineering. Computer hardware. Photoelectronic devices Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril Fabrication of micro magnetometer using flip-chip bonding technique |
| description |
Magnetic field has been widely explored for its benefit towards todays development. In the early stage, the main
concern was to develop a device that can detect magnetic field. Such device is called magnetometer. The advancement of technology has push the boundary even further, making a portable and robust magnetometer. Although the miniaturization of magnetometer has been widely researched and studied, the process however is not. Thus, the process governing the fabrication technique is studied in this paper. Conventional method of fabrication is known as surface micromachining. Besides time
consuming, this method requires many consecutive steps in fabrication process and careful alignment of patterns on every
layer which increase the complexity. Hence, studies are done to improve time consuming and reliability of the
microfabrication process. The objective of this research include designing micro scale magnetometer and complete device
fabrication processes. A micro-scale search coil magnetometer of 15 windings with 600μm thickness of wire and 300μm
distance between each wire has been designed. |
| format |
Conference or Workshop Item |
| author |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
| author_facet |
Tengku Azmi, Tengku Muhammad Afif Sulaiman, Nadzril |
| author_sort |
Tengku Azmi, Tengku Muhammad Afif |
| title |
Fabrication of micro magnetometer using flip-chip
bonding technique |
| title_short |
Fabrication of micro magnetometer using flip-chip
bonding technique |
| title_full |
Fabrication of micro magnetometer using flip-chip
bonding technique |
| title_fullStr |
Fabrication of micro magnetometer using flip-chip
bonding technique |
| title_full_unstemmed |
Fabrication of micro magnetometer using flip-chip
bonding technique |
| title_sort |
fabrication of micro magnetometer using flip-chip
bonding technique |
| publishDate |
2017 |
| url |
http://irep.iium.edu.my/56707/ http://irep.iium.edu.my/56707/ http://irep.iium.edu.my/56707/12/56707_fabrication%20%20of%20Micro%20Magnet%20Magnetometer_complete.pdf |
| first_indexed |
2023-09-18T21:20:03Z |
| last_indexed |
2023-09-18T21:20:03Z |
| _version_ |
1777411821386334208 |