An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining

Micro Wire Electro Discharge Machining (μ-WEDM) is a non-conventional promising machining process which is used mainly to machine complex shaped parts for research and industrial applications. However, for machining semiconductor material with high resistivity like silicon (Si) requires some speci...

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Main Authors: Jarin, Sams, Saleh, Tanveer, Bhuiyan, Moinul, Muthalif, Asan G. A., Ali, Mohammad Yeakub
Format: Conference or Workshop Item
Language:English
English
Published: 2017
Subjects:
Online Access:http://irep.iium.edu.my/56270/
http://irep.iium.edu.my/56270/
http://irep.iium.edu.my/56270/1/060.pdf
http://irep.iium.edu.my/56270/19/56270.pdf
id iium-56270
recordtype eprints
spelling iium-562702017-08-02T07:28:06Z http://irep.iium.edu.my/56270/ An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining Jarin, Sams Saleh, Tanveer Bhuiyan, Moinul Muthalif, Asan G. A. Ali, Mohammad Yeakub T Technology (General) Micro Wire Electro Discharge Machining (μ-WEDM) is a non-conventional promising machining process which is used mainly to machine complex shaped parts for research and industrial applications. However, for machining semiconductor material with high resistivity like silicon (Si) requires some special techniques to produce better machining stability during the μ-WEDM operation process. One of such ways is to coat Si temporarily with a conductive coating (such as gold or copper) that enhances the discharge current flow through Si workpiece. In this study, temporarily gold coated silicon wafer has been machined by μ-WEDM where workpieces were submerged into the nano powder mixed dielectric medium. This causes the dielectric strength of the medium to be lowered and machining can be carried out more smoothly. The main aim of this work is to identify the effects of nano powder assisted μ-WEDM operation on gold coated silicon wafer. The machining efficiency of the gold (Au) coated Si wafer were determined by the average surface roughness (ASR), material removal rate (MRR) and spark gap (SG). Based on the experimental observation, it has been found that for most of the experiments, the MRR of Si were higher for nanopowder assisted WEDM operation (almost 39% improved). The SG was however, increased (from 2% to159% range) when nanopowder was used in the dielectric medium. Finally, the ASR of the WEDMed surface were observed to be significantly lower (from 4% to 121% maximum) for the nano powder mixed dielectric medium than pure dielectric medium. 2017 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/56270/1/060.pdf application/pdf en http://irep.iium.edu.my/56270/19/56270.pdf Jarin, Sams and Saleh, Tanveer and Bhuiyan, Moinul and Muthalif, Asan G. A. and Ali, Mohammad Yeakub (2017) An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining. In: 2017 World Congress on Micro and Nano Manufacturing, 27th-30th March 2017, Kaohsiang, Taiwan. http://ww2.me.ntu.edu.tw/wcmnm2017/
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
English
topic T Technology (General)
spellingShingle T Technology (General)
Jarin, Sams
Saleh, Tanveer
Bhuiyan, Moinul
Muthalif, Asan G. A.
Ali, Mohammad Yeakub
An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
description Micro Wire Electro Discharge Machining (μ-WEDM) is a non-conventional promising machining process which is used mainly to machine complex shaped parts for research and industrial applications. However, for machining semiconductor material with high resistivity like silicon (Si) requires some special techniques to produce better machining stability during the μ-WEDM operation process. One of such ways is to coat Si temporarily with a conductive coating (such as gold or copper) that enhances the discharge current flow through Si workpiece. In this study, temporarily gold coated silicon wafer has been machined by μ-WEDM where workpieces were submerged into the nano powder mixed dielectric medium. This causes the dielectric strength of the medium to be lowered and machining can be carried out more smoothly. The main aim of this work is to identify the effects of nano powder assisted μ-WEDM operation on gold coated silicon wafer. The machining efficiency of the gold (Au) coated Si wafer were determined by the average surface roughness (ASR), material removal rate (MRR) and spark gap (SG). Based on the experimental observation, it has been found that for most of the experiments, the MRR of Si were higher for nanopowder assisted WEDM operation (almost 39% improved). The SG was however, increased (from 2% to159% range) when nanopowder was used in the dielectric medium. Finally, the ASR of the WEDMed surface were observed to be significantly lower (from 4% to 121% maximum) for the nano powder mixed dielectric medium than pure dielectric medium.
format Conference or Workshop Item
author Jarin, Sams
Saleh, Tanveer
Bhuiyan, Moinul
Muthalif, Asan G. A.
Ali, Mohammad Yeakub
author_facet Jarin, Sams
Saleh, Tanveer
Bhuiyan, Moinul
Muthalif, Asan G. A.
Ali, Mohammad Yeakub
author_sort Jarin, Sams
title An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
title_short An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
title_full An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
title_fullStr An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
title_full_unstemmed An improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
title_sort improved machining process of polished silicon using nano powder mixed micro-wire electro discharge machining
publishDate 2017
url http://irep.iium.edu.my/56270/
http://irep.iium.edu.my/56270/
http://irep.iium.edu.my/56270/1/060.pdf
http://irep.iium.edu.my/56270/19/56270.pdf
first_indexed 2023-09-18T21:19:21Z
last_indexed 2023-09-18T21:19:21Z
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